MT48H16M32LFCM-75 IT:B TR Micron Technology Inc, MT48H16M32LFCM-75 IT:B TR Datasheet - Page 13

• Manufacturer Part Number: MT48H16M32LFCM-75 IT:B TR
• Description: IC SDRAM 512MBIT 133MHZ 90VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT48H16M32LFCM-75 IT:B TR

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 90-VFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1387-2

Package Dimensions
Figure 5: 54-Ball VFBGA (8mm x 9mm)
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
condition. The pre-
diameter refers
reflow balls are
SMD ball pads.
Ø0.42 on Ø0.4
to post reflow
54X Ø0.45
Seating
plane
6.4
Solder ball
0.1 A
0.8 TYP
3.2
Note:
A
9
1. 1. All dimensions are in millimeters.
8
3.2
7
8 ±0.1
6.4
3
4 ±0.05
2
1
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
A
B
C
D
E
F
G
H
J
0.8
TYP
4.5 ±0.05
0.65 ±0.05
13
Ball A1 ID
9 ± 0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
© 2007 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID