CY7C1019DV33-10ZSXI Cypress Semiconductor Corp, CY7C1019DV33-10ZSXI Datasheet

IC SRAM 1MBIT 10NS 32TSOP

CY7C1019DV33-10ZSXI

Manufacturer Part Number
CY7C1019DV33-10ZSXI
Description
IC SRAM 1MBIT 10NS 32TSOP
Manufacturer
Cypress Semiconductor Corp
Type
Asynchronousr
Datasheet

Specifications of CY7C1019DV33-10ZSXI

Memory Size
1M (128K x 8)
Package / Case
32-TSOP II
Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Speed
10ns
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Access Time
10 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Current
60 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Ports
1
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-1967
CY7C1019DV33-10ZSXI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1019DV33-10ZSXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY7C1019DV33-10ZSXIT
Quantity:
1 000
Cypress Semiconductor Corporation
Document #: 38-05481 Rev. *E
Features
Note
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com
• Pin- and function-compatible with CY7C1019CV33
• High speed
• Low Active Power
• Low CMOS Standby Power
• 2.0V Data retention
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Center power/ground pinout
• Easy memory expansion with CE and OE options
• Available in Pb-free 32-pin 400-Mil wide Molded SOJ,
Logic Block Diagram
— t
— I
— I
32-pin TSOP II and 48-ball VFBGA packages
AA
CC
SB2
= 10 ns
= 60 mA @ 10 ns
= 3 mA
CE
WE
OE
A
A
A
A
A
A
A
A
A
0
1
2
3
4
5
6
7
8
198 Champion Court
INPUTBUFFER
128K × 8
DECODER
ARRAY
COLUMN
POWER
Functional Description
The CY7C1019DV33 is a high-performance CMOS static
RAM organized as 131,072 words by 8 bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE), an
active LOW Output Enable (OE), and three-state drivers. This
device has an automatic power-down feature that significantly
reduces power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O
pins (I/O
specified on the address pins (A
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing Write
Enable (WE) HIGH. Under these conditions, the contents of
the memory location specified by the address pins will appear
on the I/O pins.
The eight input/output pins (I/O
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), or during a write
operation (CE LOW, and WE LOW).
The CY7C1019DV33 is available in Pb-free 32-pin 400-Mil
wide Molded SOJ, 32-pin TSOP II and 48-ball VFBGA
packages.
DOWN
1-Mbit (128K x 8) Static RAM
0
San Jose
through I/O
,
CA 95134-1709
7
) is then written into the location
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
[1]
0
0
1
2
3
4
5
6
7
0
Revised December 14, 2010
through I/O
through A
CY7C1019DV33
16
7
) are placed in a
).
408-943-2600
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Related parts for CY7C1019DV33-10ZSXI

CY7C1019DV33-10ZSXI Summary of contents

Page 1

... The eight input/output pins (I/O high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), or during a write operation (CE LOW, and WE LOW). The CY7C1019DV33 is available in Pb-free 32-pin 400-Mil wide Molded SOJ, 32-pin TSOP II and 48-ball VFBGA packages. INPUTBUFFER 128K × 8 ...

Page 2

... Maximum Operating Current Maximum Standby Current [2] Pin Configurations 48-ball VFBGA (Top View Note 2. NC pins are not connected on the die. Document #: 38-05481 Rev. *E –10 (Industrial I I I/O I CY7C1019DV33 Unit SOJ/TSOPII Top View I I/O I I I Page [+] Feedback ...

Page 3

... MAX RC 66MHz 40MHz Max > > < MAX Max > V – 0.3V > V – 0. < 0.3V CY7C1019DV33 [3] ................................ –0. 0.3V CC Ambient V Speed CC Temperature 3.3V  0.3V –40C to +85 –10 (Industrial) Unit Min. Max. 2.4 V 0 –0.3 0.8 V A –1 +1 A – ...

Page 4

... A CC Test Conditions Still Air, soldered × 4.5 inch, four-layer printed circuit board [5] 3.0V GND 30 pF* Rise Time: 1 V/ns High-Z characteristics: R1 317  3.3V OUTPUT 351 (c) CY7C1019DV33 Max. Unit SOJ TSOP II VFBGA Unit C/W 56.29 62.22 36 C/W 38.14 21.43 9 ALL INPUT PULSES ...

Page 5

... The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of t Document #: 38-05481 Rev. *E [6] Min. 100 values until the first memory access can be performed CC is less than less than t , and t HZCE LZCE HZOE LZOE HZWE and t HZWE CY7C1019DV33 –10 (Industrial) Unit Max.  ...

Page 6

... CE > > V – 0. < 0. DATA RETENTION MODE 3.0V > CDR [14, 15 OHA DOE DATA VALID 50% > 50 s or stable at V > 50  CC(min.) CC(min.) CY7C1019DV33 Min. Max. Unit 2.0 V – 0.3V 3. DATA VALID t HZOE t HZCE HIGH IMPEDANCE t PD ICC 50% ISB Page [+] Feedback ...

Page 7

... If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. 19. During this period the I/Os are in the output state and input signals should not be applied. Document #: 38-05481 Rev SCE SA t SCE PWE t SD DATA VALID [17, 18 SCE PWE t SD DATA VALID IN CY7C1019DV33 Page [+] Feedback ...

Page 8

... Write Cycle No. 3 (WE Controlled, OE LOW) ADDRESS DATA I/O NOTE 19 t HZWE Truth Table I/O –I High Data Out Data High Z Document #: 38-05481 Rev. *E [12, 18 SCE PWE t SD DATA VALID Mode 7 Power-Down Read Write Selected, Outputs Disabled CY7C1019DV33 LZWE Power Standby ( Active ( Active ( Active ( Page [+] Feedback ...

Page 9

... Ordering Information Speed Ordering Code (ns) 10 CY7C1019DV33-10VXI CY7C1019DV33-10ZSXI CY7C1019DV33-10BVXI Ordering Code Definitions V33 - 10 XXX Please contact your local Cypress sales representative for availability of these parts. Document #: 38-05481 Rev. *E Package Package Type Diagram 51-85033 32-pin (400-Mil) Molded SOJ (Pb-free) 51-85095 32-pin TSOP Type II (Pb-free) ...

Page 10

... Package Diagrams Figure 1. 32-pin (400-Mil) Molded SOJ (51-85033) Figure 2. 32-pin Thin Small Outline Package Type II (51-85095) Document #: 38-05481 Rev. *E CY7C1019DV33 51-85033 *C 51-85095 *A Page [+] Feedback ...

Page 11

... Package Diagrams (continued) Figure 3. 48-ball VFBGA ( mm) (51-85150) All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05481 Rev. *E CY7C1019DV33 51-85150 *F Page [+] Feedback ...

Page 12

... Document History Page Document Title: CY7C1019DV33, 1-Mbit (128K x 8) Static RAM Document Number: 38-05481 REV. ECN NO. Issue Date ** 201560 See ECN *A 233750 See ECN *B 262950 See ECN *C 307598 See ECN *D 520652 See ECN *E 3110052 12/14/2010 Document #: 38-05481 Rev. *E Orig. of Description of Change ...

Page 13

... The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. cypress.com/go/plc CY7C1019DV33 PSoC Solutions psoc.cypress.com/solutions ...

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