AT45DB081B-CNC Atmel, AT45DB081B-CNC Datasheet
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AT45DB081B-CNC
Specifications of AT45DB081B-CNC
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AT45DB081B-CNC Summary of contents
Page 1
... Green (Pb/Halide-free) Packaging Options Description The AT45DB081B is a 2.5-volt or 2.7-volt only, serial interface Flash memory ideally suited for a wide variety of digital voice-, image-, program code- and data-storage applications. Its 8,650,752 bits of memory are organized as 4096 pages of 264 bytes each. In addition to the main memory, the AT45DB081B also contains two SRAM data buffers of 264 bytes each ...
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... VCC GND RDY/BUSY To provide optimal flexibility, the memory array of the AT45DB081B is divided into three levels of granularity comprising of sectors, blocks, and pages. The Memory Architecture Diagram illustrates the breakdown of each level and details the number of pages per sector and block. All program operations to the DataFlash occur on a page-by-page basis ...
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... SECTOR 0 BLOCK 0 BLOCK 1 BLOCK 2 BLOCK 30 BLOCK 31 BLOCK 32 BLOCK 33 BLOCK 62 BLOCK 63 BLOCK 64 BLOCK 65 BLOCK 510 BLOCK 511 Block = 2112 bytes (2K + 64) AT45DB081B PAGE ARCHITECTURE 8 Pages PAGE 0 PAGE 1 PAGE 6 PAGE 7 PAGE 8 PAGE 9 PAGE 14 PAGE 15 PAGE 16 PAGE 17 PAGE 18 PAGE 4093 PAGE 4094 PAGE 4095 ...
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... After bit 0 of the status register has been shifted out, the sequence will repeat itself (as long as CS remains AT45DB081B 4 CAR ...
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... The device density is indicated using bits and 2 of the status register. For the AT45DB081B, the four bits are and 1. The decimal value of these four binary bits does not equate to the device density; the three bits represent a combinational code relating to differ- ing densities of Serial DataFlash devices, allowing a total of sixteen different density configurations ...
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... Both the erase and the programming of the page are internally self-timed and AT45DB081B 6 . During this time, the status register will indicate that the part is ...
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... The operation is inter- nally self-timed and should take place in a maximum time of t status register will indicate that the part is busy. AT45DB081B . During this time, the status register will indi- EP XFR ...
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... CHIP SELECT (CS): The DataFlash is selected when the CS pin is low. When the device is not selected, data will not be accepted on the SI pin, and the SO pin will remain in a high-impedance state. A high-to-low transition on the CS pin is required to start an operation, and a low-to-high transition on the CS pin is required to end an operation. AT45DB081B 8 2225J–DFLSH–2/08 ...
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... CS pin will be required to start a valid instruction. The SPI mode will be automatically selected on every falling edge sampling the inactive clock state. After power is applied and V before an operational mode is started. 2225J–DFLSH–2/ the minimum datasheet value, the system should wait AT45DB081B 9 ...
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... Auto Page Rewrite through Buffer 2 Note: In Tables 2 and 3, an SCK mode designation of “Any” denotes any one of the four modes of operation (Inactive Clock Polarity Low, Inactive Clock Polarity High, SPI Mode 0, or SPI Mode 3). AT45DB081B 10 SCK Mode Inactive Clock Polarity Low or High ...
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... D4H D6H D7H E8H Note Reserved Bit P = Page Address Bit B = Byte/Buffer Address Bit x = Don’t Care 2225J–DFLSH–2/08 Address Byte Address Byte N/A N N/A N AT45DB081B Address Byte N N Additional Don’t Care Bytes Required Bytes Byte x x N/A ...
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... Output High Voltage OH Note during a buffer read is 20mA maximum. cc1 AT45DB081B 12 *NOTICE: + 0.6V CC AT45DB081B (2.5V Version) 0° 70° C – 2. the minimum specified datasheet value, the system should wait 20 ms before an opera- CC Condition CS, RESET all inputs CC at CMOS levels MHz ...
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... EP t Page Programming Time P t Page Erase Time PE t Block Erase Time BE t RESET Pulse Width RST t RESET Recovery Time REC 2225J–DFLSH–2/08 AT45DB081B AT45DB081B (2.5V Version) AT45DB081B Min Max Min Max 250 250 250 250 250 250 200 200 ...
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... SPI Mode 3. Waveform 1 – Inactive Clock Polarity Low and SPI Mode 0 CS SCK HIGH IMPEDANCE SO SI Waveform 2 – Inactive Clock Polarity High and SPI Mode CSS SCK HIGH AT45DB081B 14 2. 2.0 DRIVING MEASUREMENT 0.8 LEVELS LEVEL 0.45V DEVICE UNDER TEST ...
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... For densities larger than 8M bits, the “r” bits become the most significant Page Address bit for the appropriate density. 2225J–DFLSH–2/08 SI CMD 8 bits 8 bits Page Address (PA11-PA0) (BA8-BA0/BFA8-BFA0) AT45DB081B t t REC CSS t RST HIGH IMPEDANCE 8 bits LSB Byte/Buffer Address ...
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... PA11-7 Buffer Write CS SI CMD Buffer to Main Memory Page Program (Data from Buffer Programmed into Flash Page Each transition represents 8 bits and 8 clock cycles AT45DB081B 16 FLASH MEMORY ARRAY PAGE PROGRAM THROUGH BUFFER 2 PAGE PROGRAM THROUGH BUFFER 1 I/O INTERFACE SI PA6-0, BFA8 BFA7-0 ...
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... FLASH MEMORY ARRAY MAIN MEMORY PAGE READ I/O INTERFACE SO PA6-0, BA8 BA7-0 X Starts reading page data into buffer CMD PA11-7 PA6-0, X X···X, BFA8 CMD X BFA7-0 AT45DB081B MAIN MEMORY PAGE TO BUFFER 2 BUFFER 2 (264 BYTES) BUFFER 2 READ n 1st byte read ...
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... Detailed Bit-level Read Timing – Inactive Clock Polarity Low Continuous Array Read (Opcode: 68H) CS SCK HIGH-IMPEDANCE SO Main Memory Page Read (Opcode: 52H) CS SCK COMMAND OPCODE AT45DB081B DATA OUT HIGH-IMPEDANCE LSB MSB BIT 2111 BIT PAGE n PAGE n DATA OUT MSB D 5 2225J–DFLSH–2/08 ...
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... Detailed Bit-level Read Timing – Inactive Clock Polarity Low (Continued) Buffer Read (Opcode: 54H or 56H) CS SCK COMMAND OPCODE Status Register Read (Opcode: 57H) CS SCK COMMAND OPCODE HIGH-IMPEDANCE SO 2225J–DFLSH–2/ HIGH-IMPEDANCE AT45DB081B DATA OUT MSB STATUS REGISTER OUTPUT MSB LSB MSB 19 ...
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... Detailed Bit-level Read Timing – Inactive Clock Polarity High Continuous Array Read (Opcode: 68H) CS SCK HIGH-IMPEDANCE SO Main Memory Page Read (Opcode: 52H) CS SCK COMMAND OPCODE AT45DB081B DATA OUT HIGH-IMPEDANCE LSB MSB BIT 2111 BIT PAGE n PAGE n DATA OUT MSB D 4 2225J–DFLSH–2/08 ...
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... Detailed Bit-level Read Timing – Inactive Clock Polarity High (Continued) Buffer Read (Opcode: 54H or 56H) CS SCK COMMAND OPCODE Status Register Read (Opcode: 57H) CS SCK COMMAND OPCODE HIGH-IMPEDANCE SO 2225J–DFLSH–2/ HIGH-IMPEDANCE AT45DB081B DATA OUT MSB STATUS REGISTER OUTPUT MSB LSB MSB 21 ...
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... Detailed Bit-level Read Timing – SPI Mode 0 Continuous Array Read (Opcode: E8H) CS SCK HIGH-IMPEDANCE SO Main Memory Page Read (Opcode: D2H) CS SCK COMMAND OPCODE AT45DB081B DATA OUT HIGH-IMPEDANCE LSB MSB BIT 2111 BIT PAGE n PAGE n DATA OUT MSB D 4 2225J–DFLSH–2/08 ...
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... Detailed Bit-level Read Timing – SPI Mode 0 Buffer Read (Opcode: D4H or D6H) CS SCK COMMAND OPCODE Status Register Read (Opcode: D7H) CS SCK COMMAND OPCODE HIGH-IMPEDANCE SO 2225J–DFLSH–2/ HIGH-IMPEDANCE AT45DB081B DATA OUT MSB STATUS REGISTER OUTPUT MSB LSB MSB 23 ...
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... Detailed Bit-level Read Timing – SPI Mode 3 Continuous Array Read (Opcode: E8H) CS SCK HIGH-IMPEDANCE SO Main Memory Page Read (Opcode: D2H) CS SCK COMMAND OPCODE AT45DB081B DATA OUT HIGH-IMPEDANCE LSB MSB BIT 2111 BIT PAGE n PAGE n DATA OUT MSB D 4 2225J–DFLSH–2/08 ...
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... Detailed Bit-level Read Timing – SPI Mode 3 (Continued) Buffer Read (Opcode: D4H or D6H) CS SCK COMMAND OPCODE Status Register Read (Opcode: D7H) CS SCK COMMAND OPCODE HIGH-IMPEDANCE SO 2225J–DFLSH–2/ HIGH-IMPEDANCE AT45DB081B DATA OUT MSB STATUS REGISTER OUTPUT MSB LSB MSB 25 ...
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... A page can be written using either a Main Memory Page Program operation or a Buffer Write operation followed by a Buffer to Main Memory Page Program operation. 3. The algorithm above shows the programming of a single page. The algorithm will be repeated sequentially for each page within the entire array. AT45DB081B 26 START provide address ...
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... ADDRESS POINTER END PA8 PA7 PA6 • • • • • • • • • AT45DB081B If planning to modify multiple bytes currently stored within a page of the Flash array PA5 PA4 PA3 PA2 - PA0 • • • • • • • • • ...
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... Wide, Plastic Gull Wing Small Outline Package (SOIC) 28T 28-lead, Plastic Thin Small Outline Package (TSOP) AT45DB081B 28 Ordering Code AT45DB081B-CC AT45DB081B-CNC AT45DB081B-RC AT45DB081B-TC AT45DB081B-CI AT45DB081B-CNI AT45DB081B-RI AT45DB081B-TI AT45DB081B-CC-2.5 AT45DB081B-CNC-2.5 AT45DB081B-RC-2.5 AT45DB081B-TC-2.5 Ordering Code AT45DB081B-CNU AT45DB081B-RU AT45DB081B-TU AT45DB081B-CU Package Type Package Operation Range 14C1 Commercial 8CN3 (0° 70° C) ...
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... B C 4.0 (0.157 0.46 (0.018) 1.00 (0.0394) BSC DIA BALL TYP BOTTOM VIEW TITLE 14C1, 14-ball ( Array), 4 1.4 mm Body, 1.0 mm Ball Pitch Chip-scale Ball Grid Array Package (CBGA) AT45DB081B SIDE VIEW 0.30 (0.012)MIN 1.50 (0.059) REF DRAWING NO. 04/11/01 REV. 14C1 A 29 ...
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... All dimensions and tolerance conform to ASME Y 14.5M, 1994. 2. The surface finish of the package shall be EDM Charmille #24-27. 3. Unless otherwise specified tolerance: Decimal ±0.05, Angular ±2 4. Metal Pad Dimensions. 2325 Orchard Parkway San Jose, CA 95131 R AT45DB081B 30 D Top View Side View Pin1 Pad Corner L1 ...
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... Mold Flash or protrusion shall not exceed 0.25 mm (0.010"). 2325 Orchard Parkway San Jose, CA 95131 R 2225J–DFLSH–2/ TITLE 28R, 28-lead, 0.330" Body Width, Plastic Gull Wing Small Outline (SOIC) AT45DB081B COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX SYMBOL A 2.39 – 2.79 A1 0.050 – 0.356 D 18 ...
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... E Notes: 1. This package conforms to JEDEC reference MO-183. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion 0.15 mm per side and 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. 2325 Orchard Parkway San Jose, CA 95131 R AT45DB081B 32 PIN SEATING PLANE A1 TITLE 28T, 28-lead (8 x 13.4 mm) Plastic Thin Small Outline Package, Type I (TSOP) 0º ...
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... Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT ...