IS93C66A-2ZLI ISSI, Integrated Silicon Solution Inc, IS93C66A-2ZLI Datasheet - Page 14

• Manufacturer Part Number: IS93C66A-2ZLI
• Description: IC EEPROM 4KBIT 3MHZ 8TSSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS93C66A-2ZLI

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 4K (512 x 8 or 256 x 16)
• Speed: 1MHz, 2MHz, 3MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic DIP
Package Code: N,P
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. D
02/14/03
S
Sym.
N0.
Leads
A
A1
B
B1
B2
C
D
E
E1
e A
e
L
S
32-PIN ONLY
FOR
Min.
6.20
8.13
3.18
0.64
3.68
0.38
0.36
1.14
0.81
0.20
9.12
7.62
MILLIMETERS
2.54 BSC
8
L
0.762
Max.
4.57
0.56
1.52
1.17
0.33
9.65
6.60
9.53
8.26
—
—
S
N
1
0.244
0.320
0.125
0.025
Min.
0.145
0.015
0.014
0.045
0.032
0.008
0.359
0.300
0.100 BSC
INCHES
e
0.180
0.022
0.060
0.046
0.013
0.260
0.380
0.030
Max.
0.375
0.325
—
—
B
D
1-800-379-4774
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and
4. Formed leads shall be planar with respect to one another within 0.004
B1
be measured from the bottom of the package
inches at the seating plane.
B2
E1
A
A1
.
C
SEATING PLANE
E
e A
should