MT47H64M8B6-25E L:D TR Micron Technology Inc, MT47H64M8B6-25E L:D TR Datasheet - Page 100

• Manufacturer Part Number: MT47H64M8B6-25E L:D TR
• Description: IC DDR2 SDRAM 512MBIT 60VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M8B6-25E L:D TR

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (64M x 8)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 60-FBGA
• Organization: 64Mx8
• Density: 512Mb
• Address Bus: 16b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 205mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1427-2

Table 42: WRITE Using Concurrent Auto Precharge
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
WRITE with auto precharge
From Command
(Bank n)
the WRITE diagrams show the nominal case, and where the two extreme cases (
[MIN] and
(page 101) shows the nominal case and the extremes of
tion of a burst, assuming no other commands have been initiated, the DQ will remain
High-Z and any additional input data will be ignored.
Data for any WRITE burst may be concatenated with a subsequent WRITE command to
provide continuous flow of input data. The first data element from the new burst is ap-
plied after the last element of a completed burst. The new WRITE command should be
issued x cycles after the first WRITE command, where x equals BL/2.
Figure 57 (page 102) shows concatenated bursts of BL = 4 and how full-speed random
write accesses within a page or pages can be performed. An example of nonconsecutive
WRITEs is shown in Figure 58 (page 102). DDR2 SDRAM supports concurrent auto pre-
charge options, as shown in Table 42.
DDR2 SDRAM does not allow interrupting or truncating any WRITE burst using BL = 4
operation. Once the BL = 4 WRITE command is registered, it must be allowed to com-
plete the entire WRITE burst cycle. However, a WRITE BL = 8 operation (with auto
precharge disabled) might be interrupted and truncated only by another WRITE burst
as long as the interruption occurs on a 4-bit boundary due to the 4n-prefetch architec-
ture of DDR2 SDRAM. WRITE burst BL = 8 operations may not be interrupted or
truncated with any command except another WRITE command, as shown in Figure 59
(page 103).
Data for any WRITE burst may be followed by a subsequent READ command. To follow
a WRITE,
cycles required to meet
WRITE burst may be followed by a subsequent PRECHARGE command.
met, as shown in Figure 61 (page 105).
less of the data mask condition.
WRITE or WRITE with auto precharge
READ or READ with auto precharge
t
PRECHARGE or ACTIVATE
WTR should be met, as shown in Figure 60 (page 104). The number of clock
t
DQSS [MAX]) might not be intuitive, they have also been included. Figure 56
To Command
(Bank m)
t
WTR is either 2 or
100
t
Micron Technology, Inc. reserves the right to change products or specifications without notice.
WR starts at the end of the data burst, regard-
t
512Mb: x4, x8, x16 DDR2 SDRAM
WTR/
(with Concurrent Auto Precharge)
t
CK, whichever is greater. Data for any
(CL - 1) + (BL/2) +
Minimum Delay
t
DQSS for BL = 4. Upon comple-
(BL/2)
1
©2004 Micron Technology, Inc. All rights reserved.
t
WTR
t
WR must be
WRITE
t
DQSS
Units
t
t
t
CK
CK
CK