W25P16VSSIG Winbond Electronics, W25P16VSSIG Datasheet - Page 37

• Manufacturer Part Number: W25P16VSSIG
• Description: IC FLASH 16MBIT 50MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25P16VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 50MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AC Electrical Characteristics, continued
Notes:
1. Clock high + Clock low must be less than or equal to 1/f
2. Value guaranteed by design and/or characterization, not 100% tested in production.
3. Expressed as a slew-rate.
4. Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set at 1.
5. Maximum Tpp uses worse-case user pattern at 85°C.
/HOLD Not Active Setup Time relative to CLK
/HOLD Not Active Hold Time relative to CLK
/HOLD to Output Low-Z
/HOLD to Output High-Z
Write Protect Setup Time Before /CS Low
Write Protect Hold Time After /CS High
/CS High to Power-down Mode
/CS High to Standby Mode without Electronic
Signature Read
/CS High to Standby Mode with Electronic
Signature Read
Write Status Register Cycle Time
Page Program Cycle Time
3.0V-3.6V VCC
2.7V-3.6V VCC
Sector Erase Cycle Time
Chip Erase Cycle Time W25P80
Chip Erase Cycle Time W25P16
Parameter Page Erase Cycle Time
DESCRIPTION
(5)
C
.
- 37 -
SYMBOL
t
t
t
t
t
t
HHQX
WHSL
SHWL
HLQZ
RES
RES
t
t
t
HHCH
CHHL
DP
t
t
t
t
t
PP
SE
CE
PE
W
1
2
(2)
W25P80 AND W25P16
(2)
(2)
(2)
(2)
(4)
(4)
Publication Release Date: January 19, 2007
ALT
t
t
HZ
LZ
MIN
100
20
5
5
SPEC
TYP
100
3.5
0.6
17
12
4
7
MAX
200
1.5
30
30
25
15
25
9
9
3
7
8
Revision M
UNIT
ms
ms
ms
ms
ns
ns
ns
ns
ns
ns
µs
µs
µs
s
s
s