CY7C1480V33-200AXCT Cypress Semiconductor Corp, CY7C1480V33-200AXCT Datasheet - Page 14

• Manufacturer Part Number: CY7C1480V33-200AXCT
• Description: IC SRAM 72MBIT 200MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1480V33-200AXCT

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 72M (2M x 36)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Document Number: 38-05283 Rev. *J
The SRAM clock input might not be captured correctly if there
is no way in a design to stop (or slow) the clock during a
SAMPLE/PRELOAD instruction. If this is an issue, it is still
possible to capture all other signals and simply ignore the
value of the CLK captured in the boundary scan register.
After the data is captured, the data can be shifted out by
putting the TAP into the Shift-DR state. This places the
boundary scan register between the TDI and TDO balls.
Note that because the PRELOAD part of the command is not
implemented, putting the TAP to the Update-DR state while
performing a SAMPLE/PRELOAD instruction has the same
effect as the Pause-DR command.
TAP Timing
TAP AC Switching Characteristics
Clock
t
t
t
t
Output Times
t
t
Setup Times
t
t
t
Hold Times
t
t
t
Notes
Parameter
TCYC
TF
TH
TL
TDOV
TDOX
TMSS
TDIS
CS
TMSH
TDIH
CH
9. t
10. Test conditions are specified using the load in TAP AC Test Conditions. t
CS
and t
CH
refer to the setup and hold time requirements of latching data from the boundary scan register.
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH Time
TCK Clock LOW Time
TCK Clock LOW to TDO Valid
TCK Clock LOW to TDO Invalid
TMS Setup to TCK Clock Rise
TDI Setup to TCK Clock Rise
Capture Setup to TCK Rise
TMS Hold after TCK Clock Rise
TDI Hold after Clock Rise
Capture Hold after Clock Rise
Test M ode Select
Test Data-Out
Test Data-In
Test Clock
(TDO)
(TM S)
(TCK )
(TDI)
1
Description
Over the Operating Range
t TM SS
t TDIS
2
t TM SH
t TDIH
t TH
DON’T CA RE
R
/t
t
TL
F
= 1 ns.
3
BYPASS
When the BYPASS instruction is loaded in the instruction
register and the TAP is placed in a Shift-DR state, the bypass
register is placed between the TDI and TDO balls. The
advantage of the BYPASS instruction is that it shortens the
boundary scan path when multiple devices are connected
together on a board.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
t CY C
[9, 10]
UNDEFINED
4
t TDOX
t TDOV
5
Min.
50
20
20
0
5
5
5
5
5
5
6
CY7C1480V33
CY7C1482V33
CY7C1486V33
Max.
20
10
Page 14 of 31
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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