M24C04-WMN6P STMicroelectronics, M24C04-WMN6P Datasheet - Page 28

• Manufacturer Part Number: M24C04-WMN6P
• Description: IC EEPROM 4KBIT 400KHZ 8SOIC
• Manufacturer: STMicroelectronics

Specifications of M24C04-WMN6P

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 4K (512 x 8)
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 512 x 8
• Interface Type: I2C
• Maximum Clock Frequency: 0.4 MHz
• Access Time: 900 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Capacitance, Input: 8 pF (SDA), 6 pF (Other Pins)
• Current, Input, Leakage: ±2 μA
• Current, Operating: 2 mA
• Current, Output, Leakage: ±2
• Current, Supply: 3 mA
• Data Retention: >40 yrs.
• Density: 4K
• Package Type: SO8
• Temperature, Operating: -40 to +85 °C
• Temperature, Operating, Maximum: 85 °C
• Temperature, Operating, Minimum: -40 °C
• Time, Access: 900 ns
• Time, Fall: 50 ns
• Time, Rise: 50 ns
• Voltage, Esd: 4000 V
• Voltage, Input, High: 3.5 to 6.5 V
• Voltage, Input, High Level: 0.7 V
• Voltage, Input, Low: 0.75 to 1.65 V
• Voltage, Input, Low Level: –0.45 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.5 to 5.5 V
• Memory Configuration: 512 X 8
• Clock Frequency: 400kHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8562; M24C04-WMN6P

M24C16, M24C08, M24C04, M24C02, M24C01
REVISION HISTORY
Table 25. Document Revision History
28/29
05-May-2000
05-May-2003
10-Dec-1999
23-Nov-2000
19-Feb-2001
09-Nov-2001
04-Feb-2003
17-Mar-2004
18-Apr-2000
20-Apr-2001
08-Oct-2001
07-Oct-2003
30-Jul-2002
Date
Version
2.4
2.5
2.6
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4.0
5.0
TSSOP8 Turned-Die package removed (p 2 and order information)
Lead temperature added for TSSOP8 in table 2
Labelling change to Fig-2D, correction of values for ‘E’ and main caption for Tab-13
Extra labelling to Fig-2D
SBGA package information removed to an annex document
-R range changed to being the -S range, and the new -R range added
SBGA package information put back in this document
Lead Soldering Temperature in the Absolute Maximum Ratings table amended
Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data updated
Wording brought in to line with standard glossary
Revision of DC and AC characteristics for the -S series
Ball numbers added to the SBGA connections and package mechanical illustrations
Specification of Test Condition for Leakage Currents in the DC Characteristics table
improved
Document reformatted using new template. SBGA5 package removed
TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range added
Document title spelt out more fully. “W”-marked devices with tw=5ms added.
-R voltage range upgraded to 400kHz working, and no longer preliminary data.
5V voltage range at temperature range 3 (-xx3) no longer preliminary data.
-S voltage range removed. -Wxx3 voltage+temp ranged added as preliminary data.
Table of contents, and Pb-free options added. Minor wording changes in Summary
Description, Power-On Reset, Memory Addressing, Read Operations. V
-0.45V. t
MLP package added. Absolute Maximum Ratings for V
Soldering temperature information clarified for RoHS compliant devices. Device grade
information clarified. Process identification letter “G” information added. 2.2-5.5V range is
removed, and 4.5-5.5V range is now Not for New Design
W
(max) value for -R voltage range corrected.
Description of Revision
IO
(min) and V
CC
(min) changed.
IL
(min) improved to