W25X64VZEIG Winbond Electronics, W25X64VZEIG Datasheet - Page 40

• Manufacturer Part Number: W25X64VZEIG
• Description: IC FLASH 64MBIT 75MHZ 8WSON
• Manufacturer: Winbond Electronics

Specifications of W25X64VZEIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-WSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

14.
14.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
package.
PACKAGE SPECIFICATION
SYMBOL
E1
D
CP
e
A1
A2
C
A
E
b
L
θ
(2)
(3)
(3)
1.47
0.10
0.33
0.19
4.80
5.80
3.80
0.40
MIN
---
---
0
o
MILLIMETERS
W25X16, W25X16A, W25X32, W25X64
1.27 BSC
TYP.
1.60
1.45
0.41
0.20
4.85
6.00
3.90
0.71
---
---
---
MAX
1.72
0.24
0.50
0.25
4.95
6.19
4.00
1.27
0.10
- 40 -
---
8
o
0.0075
0.058
0.004
0.013
0.189
0.228
0.150
0.015
MIN
---
---
0
o
0.050 BSC
INCHES
0.063
0.057
0.016
0.008
0.191
0.236
0.154
0.028
TYP.
---
---
---
0.0098
0.068
0.009
0.020
0.195
0.244
0.157
0.050
0.004
MAX
---
8
o