MD8331-D2G-V3-X-P SanDisk, MD8331-D2G-V3-X-P Datasheet - Page 5

• Manufacturer Part Number: MD8331-D2G-V3-X-P
• Description: IC MDOC G4 2GB 69-FBGA
• Manufacturer: SanDisk

Specifications of MD8331-D2G-V3-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 2G (256M x 8)
• Speed: 33ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 69-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1149-2; MD8831-D2G-V3-X-P; MD8832-D2G-V3-X-P

T
1. Introduction ............................................................................................................................... 9
2. Product Overview .................................................................................................................... 10
3. Theory of Operation ................................................................................................................ 19
4. x2 Technology ......................................................................................................................... 25
5. Hardware Protection ............................................................................................................... 30
5
ABLE OF
2.1
2.2
2.3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.1
4.2
4.3
Product Description .......................................................................................................... 10
Standard Interface ............................................................................................................ 11
2.2.1
2.2.2
2.2.3
Multiplexed Interface ........................................................................................................ 15
2.3.1
2.3.2
2.3.3
Overview........................................................................................................................... 19
System Interface............................................................................................................... 20
3.2.1
3.2.2
Configuration Interface ..................................................................................................... 20
Protection and Security-Enabling Features ...................................................................... 21
3.4.1
3.4.2
3.4.3
3.4.4
3.4.5
Programmable Boot Block with eXecute In Place (XIP) Functionality.............................. 22
Download Engine (DE) ..................................................................................................... 22
Error Detection Code/Error Correction Code (EDC/ECC) ................................................ 23
Control and Status............................................................................................................ 23
Flash Architecture............................................................................................................. 23
MultiBurst Operation......................................................................................................... 25
DMA Operation................................................................................................................. 28
Combined MultiBurst Mode and DMA Operation ............................................................. 29
C
ONTENTS
Ball Diagrams ..................................................................................................................... 11
System Interface ................................................................................................................ 12
Signal Description .............................................................................................................. 13
Ball Diagram ....................................................................................................................... 15
System Interface ................................................................................................................ 16
Signal Description .............................................................................................................. 17
Standard (NOR-Like) Interface........................................................................................... 20
Multiplexed Interface .......................................................................................................... 20
Read/Write Protection ........................................................................................................ 21
Unique Identification (UID) Number ................................................................................... 21
One-Time Programmable (OTP) Area ............................................................................... 21
One-Time Write (ROM-Like) Partition ................................................................................ 22
Sticky Lock (SLOCK).......................................................................................................... 22
Data Sheet (Preliminary) Rev. 0.3
DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V
92-DS-1105-00