MD5811-D256-V3Q18-P SanDisk, MD5811-D256-V3Q18-P Datasheet - Page 66

• Manufacturer Part Number: MD5811-D256-V3Q18-P
• Description: IC MDOC P3 256MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD5811-D256-V3Q18-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.6 Device Cascading
When connecting Mobile DiskOnChip P3 256Mb using a standard interface, up to four devices can be
cascaded with no external decoding circuitry. Figure 20 illustrates the configuration required to
cascade four devices on the host bus (only the relevant cascading signals are included in this figure,
although all other signals must also be connected). All pins/balls of the cascaded devices must be
wired in common, except for ID0 and ID1. The ID input pins/balls are strapped to VCC or VSS,
according to the location of each DiskOnChip. The ID pin/ball values determine the identity of each
device. For example, the first device is identified by connecting the ID pins/balls as 00, and the last
device by connecting the ID pins/balls as 11. Systems that use only one Mobile DiskOnChip P3
256Mb must connect the ID pins/balls as 00. Additional devices must be configured consecutively as
01, 10 and 11.
When Mobile DiskOnChip P3 256 Mb uses a multiplexed interface, the value of ID[1] is set to
logic 0. Therefore, only two devices can be cascaded using ID[0].
Note: When more than one Mobile DiskOnChip P3 is cascaded, a boot block of 4KB is available.
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The Programmable Boot Block of each device is mapped to a unique address space.
WE#
OE#
CE#
VSS
VSS
ID0
ID1
CE#
OE#
WE#
Figure 20: Standard Interface, Cascaded Configuration
1st
VCC
VSS
Data Sheet, Rev. 0.3
ID0
ID1
CE#
OE#
WE#
2nd
VSS
VCC
ID0
ID1
CE#
OE#
WE#
3rd
VCC
VCC
ID0
ID1
CE#
OE#
WE#
Mobile DiskOnChip P3
4th
93-SR-009-8L