MD5811-D256-V3Q18-X-P SanDisk, MD5811-D256-V3Q18-X-P Datasheet - Page 24
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MD5811-D256-V3Q18-X-P
Manufacturer Part Number
MD5811-D256-V3Q18-X-P
Description
IC MDOC P3 256MB 48-TSOP
Manufacturer
SanDisk
Datasheet
1.MD5811-D256-V3Q18-P.pdf
(86 pages)
Specifications of MD5811-D256-V3Q18-X-P
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
256M (32M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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3.
3.1
Mobile DiskOnChip P3 consists of the following major functional blocks, as shown in Figure 7.
These components are described briefly below and in more detail in the following sections.
•
•
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•
•
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21
*ADDR[0] and DPD are multiplexed on the same ball/pin.
System Interface for the host interface.
Configuration Interface for configuring Mobile DiskOnChip P3 to operate in 8-bit, 16-bit or
32-bit mode, cascaded configuration, hardware read/write protection and entering/exiting Deep
Power-Down mode.
Read/Write Protection and OTP for advanced data/code security and protection.
Programmable Boot Block with XIP functionality enhanced with a Download Engine (DE)
for system initialization capability.
Error Detection and Error Correction Code (EDC/ECC) for on-the-fly error handling.
Data Pipeline through which the data flows from the system to the NAND flash arrays.
Control & Status block that contains registers responsible for transferring the address, data
and control information between the TrueFFS driver and the flash
Flash Interface that interfaces to two NAND flash planes.
T
Overview
HEORY OF
Figure 7: Mobile DiskOnChip P3 Simplified Block Diagram, Standard Interface
O
PERATION
Data Sheet, Rev. 0.3
media.
Mobile DiskOnChip P3
93-SR-009-8L
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