MD5832-D256-V3Q18-X-P SanDisk, MD5832-D256-V3Q18-X-P Datasheet - Page 3

• Manufacturer Part Number: MD5832-D256-V3Q18-X-P
• Description: IC MDOC P3 256MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD5832-D256-V3Q18-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 85-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TrueFFS
Operating Environment
3
Full hard-disk read/write emulation for
transparent file system management
Patented TrueFFS
Dynamic and static wear-leveling
Programming, duplicating, testing and
debugging tools available in source code
Wide OS support, including:
TrueFFS Software Development Kit (SDK)
for quick and easy support for proprietary
OSs, or OS-less environment
TrueFFS Boot Software Development Kit
(BDK)
Flash file system management
Automatic block management
Data management to maximize the limit
of typical flash life expectancy
Dynamic virtual mapping
Symbian OS (EPOC)
Pocket PC 2002/3
Smartphone 2002/3
Palm OS
Nucleus
Windows CE
Linux
®
Software
Data Sheet, Rev. 0.3
Power Requirements
Capacity and Packaging
Operating voltage
Current
256Mb (32MB) capacity
Device cascading option for up to four
devices (1Gb)
48-pin TSOP-I package:
20x12x1.2 mm (width x length x height)
85-ball FBGA package:
7x10x1.2 mm (width x length x height)
Pinout compatible with DiskOnChip Plus
TSOP-I products
Ballout compatible with DiskOnChip Plus
69-ball FBGA products: 9x12x1.4 mm
Core: 2.5V to 3.6V
I/O: 1.65 to 2.0V; or 2.5V to 3.6V
(auto-detect)
Active: 10 mA
Deep Power-Down: 10 µA
Mobile DiskOnChip P3
93-SR-009-8L