MD5811-D256-V3Q18-X SanDisk, MD5811-D256-V3Q18-X Datasheet - Page 24

• Manufacturer Part Number: MD5811-D256-V3Q18-X
• Description: IC MDOC P3 256MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD5811-D256-V3Q18-X

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

3.
3.1
Mobile DiskOnChip P3 consists of the following major functional blocks, as shown in Figure 7.
These components are described briefly below and in more detail in the following sections.
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*ADDR[0] and DPD are multiplexed on the same ball/pin.
System Interface for the host interface.
Configuration Interface for configuring Mobile DiskOnChip P3 to operate in 8-bit, 16-bit or
32-bit mode, cascaded configuration, hardware read/write protection and entering/exiting Deep
Power-Down mode.
Read/Write Protection and OTP for advanced data/code security and protection.
Programmable Boot Block with XIP functionality enhanced with a Download Engine (DE)
for system initialization capability.
Error Detection and Error Correction Code (EDC/ECC) for on-the-fly error handling.
Data Pipeline through which the data flows from the system to the NAND flash arrays.
Control & Status block that contains registers responsible for transferring the address, data
and control information between the TrueFFS driver and the flash
Flash Interface that interfaces to two NAND flash planes.
T
Overview
HEORY OF
Figure 7: Mobile DiskOnChip P3 Simplified Block Diagram, Standard Interface
O
PERATION
Data Sheet, Rev. 0.3
media.
Mobile DiskOnChip P3
93-SR-009-8L