MD2533-D8G-X-P/Y SanDisk, MD2533-D8G-X-P/Y Datasheet - Page 49
MD2533-D8G-X-P/Y
Manufacturer Part Number
MD2533-D8G-X-P/Y
Description
IC MDOC H3 8GB FBGA
Manufacturer
SanDisk
Type
Flash Disk Moduler
Specifications of MD2533-D8G-X-P/Y
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
8G (1G x 8)
Interface
Parallel
Voltage - Supply
1.65 V ~ 1.95 V, 2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
115-LFBGA
Density
1GByte
Operating Supply Voltage (typ)
1.8/3.3V
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Package Type
FBGA
Mounting
Surface Mount
Pin Count
115
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.65/2.7V
Operating Supply Voltage (max)
1.95/3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Rev. 1.2
9.
9.1
9.2
The Configuration Interface enables the designer to configure mDOC H3 to operate in different
modes.
9.3
mDOC H3 uses a NOR-like interface that can easily be connected to any microprocessor bus.
With a demux interface, it requires 16 address lines, 16 data lines and basic memory control
signals (CE#, OE#, WE#), as shown in Figure 11 below. Typically, mDOC H3 can be mapped to
any free 128KB memory space (8KB address space requires less address lines).
49
• A typical RISC processor memory architecture may include the following devices:
• The ID0 signal is used in a cascaded configuration.
• The LOCK# signal is used for hardware write/read protection
D
General Guidelines
• mDOC H3: Contains the OS image, applications, registry entries, back-up data, user
•
• ARM-based CPUs
• Texas Instruments OMAP, DBB
• Intel PXAxxx family
• Infineon xGold family
• Analog Devices (ADI) digital Baseband devices
• Freescale i.MXxx Application processors and i.xx digital Baseband devices
• Zoran ER4525
• Renesas SH mobile
• EMP platforms
• Qualcomm MSMxxxx
• Boot Device: In case mDOC H3 is not used as a boot device, ROM or NOR flash that
• RAM/DRAM Memory: This memory is used for code execution.
• Other Devices: A DSP processor, for example, may be used in a RISC architecture
Configuration
Demux (Standard) Interface
ESIGN
files and data, etc. It can also be used to perform boot operation, thereby replacing the
need for a separate boot device.
CPU: mDOC H3 is compatible with all major CPUs in the mobile phone,
(DTV), Digital Still Camera (DSC), MP3, GPS and other
Electronics Applications markets, including:
contains the boot code is required for system initialization, kernel relocation, loading
the operating systems and/or other applications and files into the RAM and executing
them.
for enhanced multimedia support.
C
ONSIDERATIONS
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
Portable Consumer
Design Considerations
Digital TV
92-DS-1205-10