SDIN2C2-2G-T SanDisk, SDIN2C2-2G-T Datasheet - Page 3

IC INAND FLASH 2GB 169FBGA

SDIN2C2-2G-T

Manufacturer Part Number
SDIN2C2-2G-T
Description
IC INAND FLASH 2GB 169FBGA
Manufacturer
SanDisk
Type
Flash Diskr
Datasheets

Specifications of SDIN2C2-2G-T

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
16G (2G x 8)
Speed
50MHz
Interface
SD/SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-25°C ~ 85°C
Package / Case
169-FBGA
Density
2GByte
Operating Supply Voltage (typ)
3.3V
Operating Temperature (min)
-25C
Operating Temperature (max)
85C
Package Type
TFBGA
Mounting
Surface Mount
Pin Count
169
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Programmable
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SDIN2C2-2G-T
Manufacturer:
SanDisk
Quantity:
10 000
Revision 1.1
© 2007 SanDisk Corporation
1. Introduction...................................................................................................1-1
2. Product Specifications...................................................................................2-1
3. iNAND Interface Description .......................................................................3-1
4. iNAND Protocol Description ........................................................................4-1
1.1 General Description ................................................................................1-1
1.2 Features...................................................................................................1-2
1.3 Document Scope.....................................................................................1-2
1.4 iNAND Standard ....................................................................................1-2
1.5 Functional Description............................................................................1-3
1.6 Technology Independence ......................................................................1-3
1.7 Defect and Error Management................................................................1-3
1.8 Wear Leveling.........................................................................................1-3
1.9 Automatic Sleep Mode ...........................................................................1-3
1.10 iNAND—SD Bus Mode ........................................................................1-4
1.11 SPI Mode ...............................................................................................1-5
2.1 Overview ................................................................................................2-1
2.2 Typical Card Power Requirements .........................................................2-1
2.3 Operating Conditions..............................................................................2-1
2.4 System Performance ...............................................................................2-2
2.5 System Reliability and Maintenance ......................................................2-2
2.6 Physical Specifications ...........................................................................2-3
3.1 Pins and Registers...................................................................................3-1
3.2 Bus Topologies .......................................................................................3-3
3.3 Electrical Interface..................................................................................3-3
3.4 iNAND Registers....................................................................................3-3
3.5 Data Interchange Format and Card Sizes ...............................................3-8
4.1 General ...................................................................................................4-1
4.2 SD Bus Protocol .....................................................................................4-1
4.3 Functional Description............................................................................4-1
Appendix A Power Delivery and Capacitor Specifications .........................A-1
Appendix B Ordering Information .............................................................. B-1
Appendix C Disclaimer of Liability ............................................................ C-1
TABLE OF CONTENTS
PRELIMINARY
ii
SanDisk iNAND Product Manual

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