MAX11080GUU+ Maxim Integrated Products, MAX11080GUU+ Datasheet - Page 3

• Manufacturer Part Number: MAX11080GUU+
• Description: IC LI/BATTERY MANAGEMENT 38TSSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX11080GUU+

• Function: Battery Monitor
• Battery Type: Lithium-Ion (Li-Ion)
• Voltage - Supply: 6 V ~ 72 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 38-TSSOP (0.173", 4.40mm Width)
• Product: Charge Management
• Operating Supply Voltage: 6 V to 72 V
• Supply Current: 0.05 uA
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Charge Safety Timers: No
• Mounting Style: SMD/SMT
• Temperature Monitoring: No
• Uvlo Start Threshold: 1.6 V
• Uvlo Stop Threshold: 2.8 V
• No. Of Batteries: 12
• Supply Voltage Range: 6V To 72V
• Battery Ic Case Style: TSSOP
• No. Of Pins: 38
• Operating Temperature Range: -40°C To +105°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

II. Manufacturing Information
III. Packaging Information
IV. Die Information
Maxim Integrated Products. All rights reserved.
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
12-Channel, High-Voltage Battery-Pack Fault Monitor
S45J
11398
California
ATP Philippines
April 22, 2009
38-pin TSSOP
Copper
100% matte Tin
Conductive Epoxy
Au (1.0 mil dia.)
Epoxy with silica filler
#05-9000-3164
Class UL94-V0
Level 3
73°C/W
11°C/W
63°C/W
11°C/W
90 X 130 mils
Si
Al/0.5% Cu
None
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide
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MAX11080