MAX17435ETG+T Maxim Integrated Products, MAX17435ETG+T Datasheet - Page 27

• Manufacturer Part Number: MAX17435ETG+T
• Description: IC SMBUS BATT CHARGER 24TQFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX17435ETG+T

• Function: Charge Management
• Battery Type: Multi-Chemistry
• Voltage - Supply: 8 V ~ 26 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2) Place the IC and signal components. Keep the
PROCESS: BiCMOS
Ideally, surface-mount power components are flush
against one another with their ground terminals
almost touching. These high-current grounds are then
connected to each other with a wide, filled zone of
top-layer copper, so they do not go through vias. The
resulting top-layer subground plane is connected to
the normal inner-layer ground plane at the paddle.
Other high-current paths should also be minimized,
but focusing primarily on short ground and current-
sense connections eliminates about 90% of all PCB
layout problems.
main switching node (LX node) away from sensitive
analog components (current-sense traces and V
capacitor). Important: The IC must be no further
than 10mm from the current-sense resistors. Quiet
connections to V
be returned to a separate ground (GND) island. The
appropriate traces are marked on the schematic with
the () ground symbol. There is very little current flowing
in these traces, so the ground island need not be
______________________________________________________________________________________
AA
, CC, ACIN, and DCIN should
Chip Information
Low-Cost SMBus Chargers
AA
3) Keep the gate drive traces (DHI and DLO) as short
4) Place ceramic bypass capacitors close to the IC. The
5) Use a single-point star ground placed directly below
Refer to the MAX17435 and MAX17535 Evaluation Kit
layouts for a layout example.
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
24 TQFN-EP
PACKAGE
very large. When placed on an inner layer, a sizable
ground island can help simplify the layout because
the low current connections can be made through
vias. The ground pad on the backside of the package
should also be connected to this quiet ground island.
as possible (L < 20mm), and route them away from
the current-sense lines and REF. These traces should
also be relatively wide (W > 1.25mm).
bulk capacitors can be placed further away. Place the
current-sense input filter capacitors under the part,
connected directly to the GND pin.
the part at the PGND pin. Connect the power ground
(ground plane) and the quiet ground island at this
location.
TYPE
High-Frequency,
PACKAGE
T2444+3
CODE
Package Information
OUTLINE
21-0139
NO.
PATTERN NO.
90-0021
LAND
27