MAX14523AATA+T Maxim Integrated Products, MAX14523AATA+T Datasheet - Page 2

• Manufacturer Part Number: MAX14523AATA+T
• Description: IC CURRENT LIMIT SWITCH 8-DFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX14523AATA+T

• Function: Current Switch
• Accuracy: ±10%
• Voltage - Input: 1.7 ~ 5.5 V
• Current - Output: Adjustable
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Sensing Method: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MAX14523AATA+T

250mA to 1.5A, Adjustable
Current-Limit Switches
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
IN, ON, ON, FLAG, OUT, and SETI to GND .............-0.3V to +6V
Current into Any Pin (Except IN, OUT)................................20mA
Out Short Circuit to GND...................................Internally Limited
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
ELECTRICAL CHARACTERISTICS
(V
are at V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
SUPPLY OPERATION
Operating Voltage
Quiescent Current
Latchoff Current
Shutdown Forward Current
Shutdown Reverse Current
INTERNAL FET
Switch-On Resistance
Forward-Current Limit
(R
Reverse Blocking Current
Reverse Blocking Threshold
Threshold
ON,
ON,
ON,
ON,
IN
TDFN (derate 24.4mW/°C above +70°C)...................1952mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
SETI
_______________________________________________________________________________________
= +1.7V to +5.5V, R
Assertion Drop Voltage
IN
+2.48k ) × I
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
INPUT
Input Leakage
Input Logic-High Voltage
Input Logic-Low Voltage
= +3.3V, T
PARAMETER
A
LIM
= +25°C.) (Note 2)
Product
SETI
= 94.2kΩ, C
A
= +70°C) for multilayer board:
V
SYMBOL
OUT
I
I
I
RSHDN
LATCH
I
SHDN
R
LEAK
I
V
V
V
V
LIM
I
ON
Q
FA
IN
IH
IL
IN
JC
- V
) ..................8°C/W
= C
JA
IN
) ...........41°C/W
OUT
I
V
fault (MAX14523B)
V
V
5.5V (current into OUT)
V
R
R
I
V
V
limit shutdown
V
switch turns on
Increase (V
asserts, I
V
LIM
OUT
IN
ON
ON
IN
IN
OUT
OUT
ON
SETI
SETI
= 1µF, and T
= 3.3V, I
= 3.3V, I
- V
, V
= 250mA to 1500mA,
= 0V, V
= 0V, V
= 0A, switch on, V
> V
- V
= 91.78k , V
= 563.12k , V
OUT
IN
IN
OUT
= V
= 1V
= 300mV, OUT falling until
IN
+ 140mV, after reverse-current-
OUT
OUT
IN
- V
limiting, V
CONDITIONS
= V
= V
or V
OUT
A
= 0A , after an overcurrent
lower than I
IN
= T
IN
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
IN
GND
) drop until
, V
, V
IN
- V
J
IN
- V
IN
= -40°C to +125°C, unless otherwise noted. Typical values
IN
IN
OUT
= 5.5V, V
= 1.7V, V
OUT
= 3.3V
= 3.3V
LIM
= 1V
= 1V
OUT
OUT
= 0V
=
127.2
1350
MIN
225
1.7
1.6
40
-1
141.4
1500
TYP
0.01
170
250
350
0.5
10
70
95
155.5
MAX
1650
300
130
275
140
5.5
0.6
0.4
+1
20
7
2
UNITS
m
mA
mV
mV
μA
μA
μA
μA
μA
μA
kV
V
V
V