LM3914N-1/NOPB National Semiconductor, LM3914N-1/NOPB Datasheet - Page 19

• Manufacturer Part Number: LM3914N-1/NOPB
• Description: IC DRIVER DOT BAR DISPLAY 18-DIP
• Manufacturer: National Semiconductor

Specifications of LM3914N-1/NOPB

• Display Type: LED, LCD, Vacuum Fluorescent
• Configuration: Dot/Bar Display
• Digits Or Characters: 10 Steps
• Current - Supply: 6.1mA
• Voltage - Supply: 3 V ~ 20 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 18-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Interface: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device
• Other names: *LM3914N-1; LM3914N-1

LM3914 MDC MWC Dot/Bar Display Driver
Die/Wafer Characteristics
SIGNAL NAME
LED NO.1
V-
V-
V+
DIV LOW END
SIG INPUT
DIV HIGH END
REF OUTPUT
REF ADJ
MODE SEL
LED NO.10
LED NO.9
LED NO.8
NC
LED NO.7
NC
LED NO.6
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
Fabrication Attributes
Physical Attributes
10
11
12
13
14
15
16
17
1
2
3
4
5
6
7
8
9
Die Bond Pad Coordinate Locations (D - Step)
-1086
-1086
-1040
-1052
-1086
1086
1057
1057
1086
-903
-745
224
846
537
343
171
X/Y COORDINATES
X
0
3914
D
150mm
2591µm x 2438µm
102.0mils x
96.0mils
330µm Nominal
175µm Nominal
Die Layout (D - Step)
19
-1154
-1160
-1126
-1154
1052
1160
1154
1154
1154
1154
-206
-377
-475
732
343
171
869
Y
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
00797035
105
105
105
105
105
101
105
105
105
105
105
105
105
105
94
94
82
X
General Die Information
PAD SIZE
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
94µm x 105µm
ALUMINUM
VOM NITRIDE
Bare Back
Floating
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105
105
105
105
105
105
105
105
128
105
105
105
105
105
94
94
94
Y