MAX4273ESE+ Maxim Integrated Products, MAX4273ESE+ Datasheet - Page 23
![IC CNTRLR HOT SWAP 16-SOIC](/photos/6/66/66630/175-16-soic_sml.jpg)
MAX4273ESE+
Manufacturer Part Number
MAX4273ESE+
Description
IC CNTRLR HOT SWAP 16-SOIC
Manufacturer
Maxim Integrated Products
Type
Hot-Swap Controllerr
Datasheet
1.MAX4271ESA.pdf
(26 pages)
Specifications of MAX4273ESE+
Applications
General Purpose
Internal Switch(s)
No
Voltage - Supply
2.7 V ~ 13.2 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Figure 18. Kelvin Connections for the Current-Sense Resistors
with Autoretry, DualSpeed/BiLevel Fault Protection
Calculate the MOSFET thermal resistance required
for a short to ground.
Using t
Figure 17 to select a duty cycle. The duty cycle
should be about 0.01 or less. This implies t
t
TOP VIEW
START
Z
3V to 12V Current-Limiting Hot-Swap Controllers
θJA
/ 0.01 = 100ms. From Figure 8, C
START
= (150°C - 85°C) / (5V
SENSE
GATE
GND
IN
______________________________________________________________________________________
1
2
4
3
= 1ms as the pulse duration, use
MAX4271
MAX4272
MAX4273
HIGH-CURRENT PATH
MAX4271
MAX4272
SO
✕
8
7
6
5
10A) = 1.30°C/W
ON
STAT
CTIM
CSPD
SENSE RESISTOR
TIM
RETRY
= 10nF.
=
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep
all traces as short as possible and to maximize the
high-current trace dimensions to reduce the effect of
undesirable parasitic inductance. Place the MAX4271/
MAX4272/MAX4273 close to the card’s connector. Use
a ground plane to minimize impedance and induc-
tance. Minimize the current-sense resistor trace length
(<10mm), and ensure accurate current sensing with
Kelvin connections (Figure 18).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence,
the power dissipation across the switch increases, as
does the die temperature. An efficient way to achieve
good power dissipation on a surface-mount package is
to lay out two copper pads directly under the MOSFET
package on both sides of the board. Connect the two
pads to the ground plane through vias, and use
enlarged copper mounting pads on the top side of the
board.
AUXVCC
LLMON
SENSE
GATE
CEXT
GND
RTH
IN
1
2
3
4
5
6
7
8
QSOP/SO
MAX4273
Pin Configurations
Layout Considerations
16
15
14
13
12
11
10
9
OUTC
INC
REF
ON
STAT
CTIM
CSPD
CTON
23