LTC4211IMS8 Linear Technology, LTC4211IMS8 Datasheet - Page 35
![IC CONTROLLER HOT SWAP 8-MSOP](/photos/7/35/73589/ltc4211ims8_sml.jpg)
LTC4211IMS8
Manufacturer Part Number
LTC4211IMS8
Description
IC CONTROLLER HOT SWAP 8-MSOP
Manufacturer
Linear Technology
Type
Hot-Swap Controllerr
Datasheet
1.LTC4211IMS8PBF.pdf
(36 pages)
Specifications of LTC4211IMS8
Applications
General Purpose
Internal Switch(s)
No
Voltage - Supply
2.5 V ~ 16.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC4211IMS8
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC4211IMS8
Manufacturer:
LT
Quantity:
20 000
Part Number:
LTC4211IMS8#TRPBF
Manufacturer:
ADI/亚德诺
Quantity:
20 000
PACKAGE DESCRIPTIO
(0.203 – 0.254)
**
0.008 – 0.010
*
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
(.0120 ± .0015)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.305 ± 0.038
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.0165 ± .0015)
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.42 ± 0.04
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
TYP
TYP
(0.254 – 0.508)
(.206)
0.010 – 0.020
5.23
MIN
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD LAYOUT
(0.406 – 1.270)
0.016 – 0.050
× 45°
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
0°– 8° TYP
0.889 ± 0.127
(.0256)
3.2 – 3.45
(.035 ± .005)
(.126 – .136)
0.65
BSC
3.2 – 3.45
(.0197)
0.50
BSC
U
8-Lead Plastic Small Outline (Narrow .150 Inch)
(1.346 – 1.752)
0.053 – 0.069
(0.355 – 0.483)
0.014 – 0.019
TYP
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1661)
(Reference LTC DWG # 05-08-1610)
GAUGE PLANE
(.077)
0.18
GAUGE PLANE
(.007)
0.18
10-Lead Plastic MSOP
8-Lead Plastic MSOP
MS8 Package
(.010)
0.254
MS Package
S8 Package
(.010)
0.254
DETAIL “A”
DETAIL “A”
DETAIL “A”
(1.270)
DETAIL “A”
0.050
BSC
(0.101 – 0.254)
0° – 6° TYP
0.004 – 0.010
0° – 6° TYP
(.021 ± .006)
0.53 ± 0.015
(.021 ± .006)
0.53 ± 0.01
SEATING
PLANE
SEATING
(5.791 – 6.197)
0.228 – 0.244
PLANE
(.192 ± .004)
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
4.88 ± 0.1
0.22 – 0.38
(NOTE 3)
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
(.192 ± .004)
0.17 – 0.27
(NOTE 3)
4.88 ± 0.10
(.043)
MAX
1.10
8
1
(.043)
1.10
MAX
(.0256)
(4.801 – 5.004)
0.65
BCS
0.189 – 0.197*
(.0197)
1
8
2
7
0.50
10
TYP
1 2 3 4 5
7 6 5
2 3
9
8
6
3
7 6
4
5
4
(.118 ± .004)
3.00 ± 0.102
(.206)
(.034)
0.52
(.118 ± .004)
REF
3.00 ± 0.102
NOTE 4
0.86
REF
(.005 ± .002)
0.497 ± 0.076
(.0196 ± .003)
0.13 ± 0.05
(.034)
(3.810 – 3.988)
0.86
NOTE 4
REF
MSOP (MS8) 0102
(.005 ± .002)
0.150 – 0.157**
0.13 ± 0.05
MSOP (MS) 1001
REF
SO8 1298
LTC4211
35
4211fa