LTC4260CGN#TRPBF Linear Technology, LTC4260CGN#TRPBF Datasheet - Page 27

IC HOT SWAP CNTRL I2C 24-SSOP

LTC4260CGN#TRPBF

Manufacturer Part Number
LTC4260CGN#TRPBF
Description
IC HOT SWAP CNTRL I2C 24-SSOP
Manufacturer
Linear Technology
Type
Hot-Swap Controllerr
Datasheet

Specifications of LTC4260CGN#TRPBF

Applications
General Purpose
Internal Switch(s)
No
Voltage - Supply
8.5 V ~ 80 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
24-SSOP (0.150", 3.90mm Width)
Family Name
LTC4260
Package Type
SSOP N
Operating Supply Voltage (min)
8.5V
Operating Supply Voltage (max)
80V
Operating Temperature (min)
0C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Product Depth (mm)
3.99mm
Mounting
Surface Mount
Pin Count
24
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC4260CGN#TRPBFLTC4260CGN
Manufacturer:
LT/凌特
Quantity:
20 000
Company:
Part Number:
LTC4260CGN#TRPBFLTC4260CGN#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC4260CGN#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC4260CGN#TRPBF
Quantity:
800
Company:
Part Number:
LTC4260CGN#TRPBFLTC4260CGN-TR
Manufacturer:
LT
Quantity:
1 385
PACKAGE DESCRIPTIO
5.50 ±0.05
4.10 ±0.05
3.45 ±0.05
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 ± 0.10
(4 SIDES)
U
32-Lead Plastic QFN (5mm × 5mm)
0.50 BSC
0.25 ± 0.05
(Reference LTC DWG # 05-08-1693)
0.70 ±0.05
UH Package
PACKAGE OUTLINE
0.75 ± 0.05
3.45 ± 0.10
(4-SIDES)
0.00 – 0.05
0.200 REF
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31
LTC4260
0.50 BSC
0.25 ± 0.05
32
(4 SIDES)
0.23 TYP
1
2
(UH) QFN 0603
27
0.40 ± 0.10
4260fa

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