MAX5961ETM+T Maxim Integrated Products, MAX5961ETM+T Datasheet - Page 3

• Manufacturer Part Number: MAX5961ETM+T
• Description: IC CTRLR HOT-SWAP QD 48-TQFN
• Manufacturer: Maxim Integrated Products
• Type: Hot-Swap Controllerr

Specifications of MAX5961ETM+T

• Applications: General Purpose, PCI Express
• Internal Switch(s): No
• Voltage - Supply: 2.7 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

II. Manufacturing Information
III. Packaging Information
IV. Die Information
Maxim Integrated Products. All rights reserved.
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
B8
156582
California, Texas, or Oregon
China, Philippines, and Thailand
2008
48-pin TQFN 7x7
Copper
100% matte Tin
Ablestick 8200
Au (.001 mil dia.)
Epoxy with silica filler
#05-9000-2905
Class UL94-V0
Level 1
36°C/W
0.8°C/W
25°C/W
0.8°C/W
216 X 191 mils
Si
Aluminum/Si (Si = 1%)
None
0.8 microns (as drawn)
0.8 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide
MAX5961ETM+
Page 3/5