NLSF595DTR2G ON Semiconductor, NLSF595DTR2G Datasheet - Page 13

• Manufacturer Part Number: NLSF595DTR2G
• Description: IC LED DRIVR LINEAR/RGB 16-TSSOP
• Manufacturer: ON Semiconductor
• Type: Linear, RGBr

Specifications of NLSF595DTR2G

• Topology: Open Drain
• Number Of Outputs: 8
• Internal Driver: Yes
• Type - Primary: General Purpose
• Type - Secondary: RGB
• Frequency: 150MHz
• Voltage - Supply: 2 V ~ 5.5 V
• Voltage - Output: 5.5V
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Operating Temperature: -55°C ~ 125°C
• Current - Output / Channel: 12mA
• Internal Switch(s): Yes
• Number Of Segments: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Supply Current: 75000 uA
• Maximum Power Dissipation: 450 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Temperature (min): -55
• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Package Type: TSSOP
• Pin Count: 16
• Mounting: Surface Mount
• Power Dissipation: 450mW
• Operating Supply Voltage (min): 2V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Efficiency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NLSF595DTR2GOS; NLSF595DTR2GOS; NLSF595DTR2GOSTR

0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.15 C
L
K
PIN 1
0.15 C
NOTE 3
A B
16X
b
4
1
Ç Ç
Ç Ç
16
BOTTOM VIEW
TOP VIEW
5
D2
D
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
e
13
0.575
0.022
0.128
3.25
8
12
9
EXPOSED PAD
e
A
B
E
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
E2
http://onsemi.com
CASE 485G−01
0.012
0.30
MN SUFFIX
NLSF595
ISSUE B
QFN−16
0.128
3.25
16 X
13
0.10 C
0.08 C
0.50
0.02
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
0.30
SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
inches
mm
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
E2
max
A
b
D
E
K
L
e
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.20
0.30
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
(A3)
MAX
1.00
0.05
0.30
1.85
1.85
0.50
−−−
A1
A
C
SEATING
PLANE