CAT3604AHV4-T2 ON Semiconductor, CAT3604AHV4-T2 Datasheet - Page 9

• Manufacturer Part Number: CAT3604AHV4-T2
• Description: IC LED DVR CHRGE PUMP 4CH 16TQFN
• Manufacturer: ON Semiconductor
• Type: Backlight, White LEDr
• Series: -r

Specifications of CAT3604AHV4-T2

• Topology: Linear (LDO), Switched Capacitor (Charge Pump)
• Number Of Outputs: 4
• Internal Driver: Yes
• Type - Primary: Backlight
• Type - Secondary: White LED
• Frequency: 800kHz ~ 1.6MHz
• Voltage - Supply: 3 V ~ 5.5 V
• Voltage - Output: 7V
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Operating Temperature: -40°C ~ 85°C
• Current - Output / Channel: 30mA
• Internal Switch(s): Yes
• Efficiency: 93%
• Constant Current: -
• Constant Voltage: -
• Led Driver Application: Backlighting
• No. Of Outputs: 4
• Output Current: 30mA
• Output Voltage: 7V
• Input Voltage: 3V To 5.5V
• Dimming Control Type: PWM / DC
• Rohs Compliant: Yes
• Operating Supply Voltage: 3 V to 5.5 V
• Maximum Supply Current: 5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Layout
1 MHz switching frequency operation requires to minimize
trace length and impedance to ground on all 4 capacitors. A
ground plane should cover the area on the bottom side of the
PCB opposite to the IC and the bypass capacitors.
Capacitors Cin and Cout require short connection to ground
which can be done with multiple vias as shown on Figure 22.
When the driver is in the 1.5x charge pump mode, the
Figure 22. PCB Layout
(V
IN
5
4
3
2
1
0
= 3.6 V, EN = V
0
Figure 21. Foldback Current Limiting
100
TYPICAL CHARACTERISTICS
IN
, C
OUTPUT CURRENT (mA)
http://onsemi.com
IN
200
= C
OUT
9
= 1 mF, unless otherwise specified.)
300
A square copper area matches the QFN16 exposed pad
(GND) which is connected by a trace to the pin 12 pad
(GND). A large via (metalized hole) centered in the square
pad provides a low impedance connection to the ground
plane on the opposite side of the PCB and allows the heat
dissipated by the driver IC to spread out resulting in
excellent thermal performance.
1x Mode
400
Figure 23. Recommended QFN 16
Package Land Pattern
500
2.25 mm
0.35 mm
0.65 mm