TC4423AVOA Microchip Technology, TC4423AVOA Datasheet - Page 15

• Manufacturer Part Number: TC4423AVOA
• Description: IC MOSFET DVR 3A DUAL HS 8SOIC
• Manufacturer: Microchip Technology
• Type: Low Sider

Specifications of TC4423AVOA

• Configuration: Low-Side
• Input Type: Inverting
• Delay Time: 40ns
• Current - Peak: 4.5A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Device Type: MOSFET
• Module Configuration: Low Side
• Peak Output Current: 4.5A
• Output Resistance: 2.2ohm
• Input Delay: 40ns
• Output Delay: 41ns
• Supply Voltage Range: 4.5V To 18V
• Driver Case Style: SOIC
• Rise Time: 21 ns
• Fall Time: 21 ns
• Supply Voltage (min): 4.5 V
• Supply Current: 2 mA
• Maximum Power Dissipation: 610 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

16-Lead Plastic Small Outline (OE) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
A
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A1
N
1
2 3
b
D
TC4423A/TC4424A/TC4425A
e
Dimension Limits
E1
A2
E
Units
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
φ
L
MIN
2.05
0.10
0.25
0.40
0.20
0.31
0°
5°
5°
–
h
L1
MILLIMETERS
10.30 BSC
10.30 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
h
16
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-102B
β
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
α
DS21998B-page 15
c