MCP1406-E/P Microchip Technology, MCP1406-E/P Datasheet - Page 14

• Manufacturer Part Number: MCP1406-E/P
• Description: IC MOSFET DVR 6A 8DIP
• Manufacturer: Microchip Technology
• Type: Dual High Speed Driverr

Specifications of MCP1406-E/P

• Number Of Outputs: 1
• Package / Case: 8-DIP (0.300", 7.62mm)
• Configuration: Low-Side
• Input Type: Inverting
• Delay Time: 40ns
• Current - Peak: 6A
• Number Of Configurations: 1
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Rise Time: 30 ns
• Fall Time: 30 ns
• Supply Voltage (min): 4.5 V
• Supply Current: 0.25 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 1
• Output Current: 6 A
• Device Type: MOSFET
• Module Configuration: Low Side
• Peak Output Current: 6A
• Output Resistance: 2.1ohm
• Input Delay: 40ns
• Output Delay: 40ns
• Supply Voltage Range: 4.5V To 18V
• Driver Case Style: DIP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP1406/07
8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S]
DS22019A-page 14
Note:
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
A3
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
N
1
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length §
Contact-to-Exposed Pad §
2
D
A1
Dimension Limits
E
A
NOTE 2
Microchip Technology Drawing No. C04–122, Sept. 8, 2006
EXPOSED PAD
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
0.80
0.00
3.90
2.20
0.35
0.50
0.20
MIN
K
MILLIMETERS
b
1.27 BSC
0.20 REF
5.00 BSC
6.00 BSC
NOM
0.85
0.01
4.00
2.30
0.40
0.60
—
8
BOTTOM VIEW
D2
e
MAX
1.00
0.05
4.10
2.40
0.48
0.75
—
2
© 2006 Microchip Technology Inc.
N
1
L
NOTE 1
E2