MCP14E4-E/SN Microchip Technology, MCP14E4-E/SN Datasheet - Page 16

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MCP14E4-E/SN

Manufacturer Part Number
MCP14E4-E/SN
Description
IC MOSFET DVR 4.0A DUAL 8SOIC
Manufacturer
Microchip Technology
Type
Low Sider
Datasheet

Specifications of MCP14E4-E/SN

Number Of Outputs
2
Configuration
Low-Side
Input Type
Non-Inverting
Delay Time
46ns
Current - Peak
4A
Number Of Configurations
2
Voltage - Supply
4.5 V ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Rise Time
30 ns
Fall Time
30 ns
Supply Voltage (min)
4.5 V
Supply Current
2 mA
Maximum Power Dissipation
665 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP14E4-E/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP14E4-E/SN
Manufacturer:
MICRCOHI
Quantity:
20 000
MCP14E3/MCP14E4/MCP14E5
DS22062B-page 16
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
Model Draft Angle Top
NOTE 1
A
A1
N
φ
1
TOP VIEW
2
D1
D
A2
Dimension Limits
E1
E
EXPOSED
A3
Units
A2
A1
A3
D1
D2
E1
E2
PAD
N
D
e
A
E
b
L
K
φ
NOTE 2
b
MIN
0.00
3.85
2.16
0.35
0.50
0.20
BOTTOM VIEW
D2
MILLIMETERS
2
1.27 BSC
0.20 REF
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
e
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
1
8
Microchip Technology Drawing C04-113B
N
E2
© 2008 Microchip Technology Inc.
NOTE 1
K
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12°
L

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