TC4425AVOA Microchip Technology, TC4425AVOA Datasheet - Page 12

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TC4425AVOA

Manufacturer Part Number
TC4425AVOA
Description
IC MOSFET DVR 3A DUAL HS 8SOIC
Manufacturer
Microchip Technology
Type
Low Sider
Datasheets

Specifications of TC4425AVOA

Configuration
Low-Side
Input Type
Inverting and Non-Inverting
Delay Time
33ns
Current - Peak
3A
Number Of Configurations
2
Number Of Outputs
2
Voltage - Supply
4.5 V ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Device Type
MOSFET
Module Configuration
Low Side
Peak Output Current
4.5A
Output Resistance
2.2ohm
Input Delay
40ns
Output Delay
41ns
Supply Voltage Range
4.5V To 18V
Driver Case Style
SOIC
Rise Time
21 ns
Fall Time
21 ns
Supply Voltage (min)
4.5 V
Supply Current
2 mA
Maximum Power Dissipation
610 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TC4425AVOA
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
TC4425AVOA713
Manufacturer:
MICROCHIP
Quantity:
12 000
TC4423A/TC4424A/TC4425A
DS21998B-page 12
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
Model Draft Angle Top
NOTE 1
A
A1
N
φ
1
TOP VIEW
2
D1
D
A2
Dimension Limits
E1
E
EXPOSED
A3
Units
A2
A1
A3
D1
D2
E1
E2
PAD
N
A
D
E
K
e
b
L
φ
NOTE 2
b
MIN
0.00
3.85
2.16
0.35
0.50
0.20
BOTTOM VIEW
D2
MILLIMETERS
2
1.27 BSC
0.20 REF
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
e
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
1
8
Microchip Technology Drawing C04-113B
N
E2
© 2007 Microchip Technology Inc.
NOTE 1
K
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12°
L

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