IR2304SPBF International Rectifier, IR2304SPBF Datasheet - Page 2

• Manufacturer Part Number: IR2304SPBF
• Description: IC DRIVER HALF BRIDGE 8-SOIC
• Manufacturer: International Rectifier

Specifications of IR2304SPBF

• Configuration: High and Low Side, Independent
• Input Type: Non-Inverting
• Delay Time: 220ns
• Current - Peak: 60mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Drivers: 2
• Driver Configuration: Non-Inverting
• Driver Type: High and Low Side
• Input Logic Level: CMOS/LSTTL
• Rise Time: 300ns
• Fall Time: 170ns
• Propagation Delay Time: 330ns
• Operating Supply Voltage (max): 20V
• Peak Output Current: 130uA
• Power Dissipation: 625mW
• Operating Supply Voltage (min): 10V
• Turn Off Delay Time: 50fs
• Turn On Delay Time (max): 50ns
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

IR2304(S)&(PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions.
Note 1: Logic operational for V
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V
2
Symbol
Symbol
dV
Rth
V
Com
V
V
V
V
V
V
P
V
V
V
T
T
V
V
T
T
HO
CC
LO
S
HO
CC
LO
IN
D
S
IN
S
B
J
L
A
B
S
JA
/dt
High side offset voltage
High side floating supply voltage
High side floating output voltage HO
Low side and logic fixed supply voltage
Low side output voltage LO
Logic input voltage (HIN, LIN)
Logic ground
Allowable offset voltage SLEW RATE
Package power dissipation @ T
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
High side floating supply voltage
High side floating supply offset voltage
High side (HO) output voltage
Low side (LO) output voltage
Logic input voltage (HIN, LIN)
Low side supply voltage
Ambient temperature
S
S
of COM -5 to COM +600V. Logic state held for V
offset rating is tested with all supplies biased at 15V differential.
Definition
Definition
A
≤ +25°C
8-Lead SOIC
8-Lead SOIC
8-Lead PDIP
8-Lead PDIP
S
V
V
V
of COM -5V to COM -V
Min.
CC
S
B
-0.3
-0.3
-0.3
-0.3
V
-50
Note 1
—
—
—
—
—
—
—
COM
Min.
- 0.3
COM
S
- 25
-40
V
-25
10
+ 10
S
V
V
V
V
V
V
CC
CC
CC
Max.
0.625
Max.
B
B
S
V
V
625
200
125
150
150
300
600
125
1.0
25
50
V
20
+ 0.3
+ 0.3
CC
CC
+ 20
+ 0.3
+ 0.3
+ 0.3
B
www.irf.com
BS
.
Units
Units
V/ns
°C/W
°C
°C
W
V
V