SI8231BB-B-IS Silicon Laboratories Inc, SI8231BB-B-IS Datasheet - Page 43

IC HIGH/LOW SIDE DRIVER 16SOIC

SI8231BB-B-IS

Manufacturer Part Number
SI8231BB-B-IS
Description
IC HIGH/LOW SIDE DRIVER 16SOIC
Manufacturer
Silicon Laboratories Inc

Specifications of SI8231BB-B-IS

Package / Case
16-SOIC (0.300", 7.5mm Width)
Configuration
High or Low Side
Input Type
Non-Inverting
Delay Time
60ns
Current - Peak
500mA
Number Of Configurations
2
Number Of Outputs
2
Voltage - Supply
6.5 V ~ 24 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Mounting Style
SMD/SMT
Number Of Channels
2
Propagation Delay Time
30 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Supply Current
2 mA
Power Dissipation
1.2 W
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Driver Configuration
Non-Inverting
Driver Type
High and Low Side
Input Logic Level
TTL
Rise Time
20ns
Fall Time
20ns
Frequency (max)
8MHz
Operating Supply Voltage (max)
5.5/24V
Peak Output Current
500mA
Output Resistance
15Ohm
Operating Supply Voltage (min)
4.5/6.5V
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
16
Package Type
SOIC W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1913-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI8231BB-B-ISR
Quantity:
2 500
12. Land Pattern: 16-Pin Narrow Body SOIC
Figure 48 illustrates the recommended land pattern details for the Si823x in a 16-pin narrow-body SOIC. Table 21
lists the values for the dimensions shown in the illustration.
Notes:
Dimension
1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X165-16N
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card
Table 21. 16-Pin Narrow Body SOIC Land Pattern Dimensions
for Density Level B (Median Land Protrusion).
fabrication tolerance of 0.05 mm is assumed.
C1
X1
Y1
E
Figure 48. 16-Pin Narrow Body SOIC PCB Land Pattern
Pad Column Spacing
Pad Row Pitch
Rev. 1.0
Pad Length
Pad Width
Feature
(mm)
5.40
1.27
0.60
1.55
Si823x
43

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