LM5109BMA/NOPB National Semiconductor, LM5109BMA/NOPB Datasheet
LM5109BMA/NOPB
Specifications of LM5109BMA/NOPB
*LM5109BMA/NOPB
LM5109BMA
Related parts for LM5109BMA/NOPB
LM5109BMA/NOPB Summary of contents
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... Independent TTL compatible inputs ■ Bootstrap supply voltage to 108V DC Simplified Block Diagram © 2007 National Semiconductor Corporation ■ Fast propagation times (30 ns typical) ■ Drives 1000 pF load with 15ns rise and fall times ■ ...
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Connection Diagrams Ordering Information Ordering Number Package Type LM5109BMA SOIC-8 LM5109BMAX SOIC-8 LM5109BSD LLP-8 LM5109BSDX LLP-8 Pin Descriptions Pin # Name SO-8 LLP Positive gate drive supply High side control input 3 3 ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications (Note Electrical Characteristics Specifications in standard typeface are for T perature range. Unless otherwise specified, V Symbol Parameter SUPPLY CURRENTS I V Quiescent Current DD DD ...
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Switching Characteristics Specifications in standard typeface are for T perature range. Unless otherwise specified, V Symbol Parameter t Lower Turn-Off Propagation Delay (LI LPHL Falling to LO Falling) t Upper Turn-Off Propagation Delay (HI HPHL Falling to HO Falling) t ...
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Typical Performance Characteristics V Operating Current vs Frequency DD Operating Current vs Temperature Quiescent Current vs Voltage HB Operating Current vs Frequency 20211904 Quiescent Current vs Temperature 20211906 Propagation Delay vs Temperature 20211908 5 20211905 20211907 20211909 www.national.com ...
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LO and HO High Level Output Voltage vs Temperature Undervoltage Rising Thresholds vs Temperature Input Thresholds vs Temperature www.national.com LO and HO Low Level Output Voltage vs Temperature 20211910 Undervoltage Hysteresis vs Temperature 20211914 Input Thresholds vs Supply Voltage 20211916 ...
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Timing Diagram Layout Considerations Optimum performance of high and low-side gate drivers can- not be achieved without taking due considerations during circuit board layout. The following points are emphasized: 1. Low ESR / ESL capacitors must be connected close to ...
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Physical Dimensions Controlling dimension is inch. Values are millimeters. Notes: Unless otherwise specified. 1. Standard lead finish to be 200 microinches/5.08 micrometers minimum lead/tin (solder) on copper. 2. Dimension does not include mold flash. Reference JEDEC ...
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... Notes: Unless otherwise specified. 1. For solder thickness and composition, see “Solder Information” in the packaging section of the National Semiconductor web page (www.national.com). 2. Maximum allowable metal burr on lead tips at the package edges is 76 microns JEDEC registration as of May 2003. LLP-8 Outline Drawing ...
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