NCP5359MNR2G ON Semiconductor, NCP5359MNR2G Datasheet - Page 8

• Manufacturer Part Number: NCP5359MNR2G
• Description: IC GATE DRIVER VR11.1/AMD 10DFN
• Manufacturer: ON Semiconductor
• Type: High Side/Low Sider

Specifications of NCP5359MNR2G

• Configuration: High and Low Side, Synchronous
• Input Type: PWM
• Delay Time: 10.0ns
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 35V
• Voltage - Supply: 10 V ~ 13.2 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Product: Driver ICs - Various
• Rise Time: 16 ns
• Supply Voltage (min): 10 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Peak: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

10X
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
10X
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
PACKAGE DIMENSIONS
C
SEATING
PLANE
MOLD CMPD
http://onsemi.com
L1
CASE 485C−01
DFN10, 3x3
MN SUFFIX
A1
ISSUE B
Bottom View
(Optional)
DETAIL A
8
*For additional information on our Pb−Free strategy and soldering
É É É
É É É
É É É
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
(Optional)
Side View
DETAIL B
0.5651
EDGE OF PACKAGE
10X
2.1746
0.3008
EXPOSED Cu
10X
SOLDERING FOOTPRINT*
A3
2.6016
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
b
D
E
K
L
e
MILLIMETERS
DIMENSIONS: MILLIMETERS
0.80
0.00
0.18
2.40
1.70
0.35
0.00
MIN
3.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
0.19 TYP
MAX
1.00
0.05
0.30
2.60
1.90
0.45
0.03
0.5000 PITCH
1.8508
3.3048