NCP5111PG ON Semiconductor, NCP5111PG Datasheet - Page 14

• Manufacturer Part Number: NCP5111PG
• Description: IC DRIVER HI/LOW SIDE HV 8-PDIP
• Manufacturer: ON Semiconductor
• Type: High Side/Low Sider

Specifications of NCP5111PG

• Configuration: Half Bridge
• Input Type: Inverting
• Delay Time: 750ns
• Current - Peak: 250mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Rise Time: 160 ns
• Fall Time: 75 ns
• Supply Voltage (min): 10 V
• Supply Current: 5 mA
• Maximum Operating Temperature: + 150 C
• Mounting Style: Through Hole
• Bridge Type: Half Bridge
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PUBLICATION ORDERING INFORMATION
The product described herein is covered by U.S. patents: 6,097,075; 7,176,723; 6,362,067. There may be some other patents pending.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
-Z-
-Y-
B
H
-X-
8
1
0.25 (0.010)
G
A
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
4
5
M
Z
S
Y
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.10 (0.004)
0.6
0.275
M
7.0
PACKAGE DIMENSIONS
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: [phone]
Japan Customer Focus Center
Phone: [phone]
SOLDERING FOOTPRINT*
Y
http://onsemi.com
M
N
CASE 751-07
X 45
SOIC-8 NB
NCP5111
ISSUE AJ
_
M
14
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751-01 THRU 751-06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751-07.
DIM
A
B
C
D
G
H
K
M
N
J
S
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
NCP5111/D
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_