MAX15024BATB+T Maxim Integrated Products, MAX15024BATB+T Datasheet - Page 2

• Manufacturer Part Number: MAX15024BATB+T
• Description: IC GATE DRVR 1CH 16NS 10TDFN-EP
• Manufacturer: Maxim Integrated Products
• Type: High Speedr

Specifications of MAX15024BATB+T

• Configuration: High-Side
• Input Type: Inverting and Non-Inverting
• Delay Time: 16ns
• Current - Peak: 4A
• Number Of Configurations: 1
• Number Of Outputs: 1
• Voltage - Supply: 6.5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-TDFN Exposed Pad
• Rise Time: 24 ns
• Fall Time: 16 ns
• Supply Voltage (min): 6.5 V
• Supply Current: 1.5 mA
• Maximum Power Dissipation: 1481.5 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Maximum Turn-off Delay Time: 18 ns
• Maximum Turn-on Delay Time: 18 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
REG to GND ..............-0.3V to the lower of +22V or (V
DRV to PGND .........................................................-0.3V to +22V
IN_ ..........................................................................-0.3V to +22V
FB/SET to GND.........................................................-0.3V to +6V
P_OUT to DRV ........................................................-22V to +0.3V
N_OUT to PGND.....................................................-0.3V to +22V
OUT1, OUT2 to PGND ..............................-0.3V to (V
PGND to GND .......................................................-0.3V to +0.3V
P_OUT, N_OUT Continuous Source/Sink Current* .......... 200mA
OUT1, OUT2 Continuous Source/Sink Current*................200mA
Single/Dual, 16ns, High Sink/Source
Current Gate Drivers
MAX15024 ELECTRICAL CHARACTERISTICS
(V
+ 25°C). (Note 2)
* Continuous output current is limited by the power dissipation of the package.
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
CC
SYSTEM SPECIFICATIONS
Input Voltage Range
V
Quiescent Supply Current
Quiescent Supply Current
Under UVLO Condition
Switching Supply Current
V
V
Hysteresis
V
Output Delay
REG REGULATOR (V
Output Voltage
Dropout Voltage
Load Regulation
Line Regulation
FB/SET Reference Voltage
FB/SET Threshold
FB/SET Input Leakage Current
CC
DRV
CC
CC
CC
_______________________________________________________________________________________
to GND ............................................................-0.3V to +30V
= V
Undervoltage Lockout
Undervoltage-Lockout
Undervoltage Lockout to
Turn-On Voltage
layer board. For detailed information on package thermal considerations, see www.maxim-ic.com/thermal.tutorial.
DRV
PARAMETER
= V
REG
= 10V, FB/SET = GND, T
CC
= 12V, REG = V
UVLO_ V
SYMBOL
V
DRV
V
V
V
R
REG
CC
_
_
DO
DRV
ON
CC
, C
A
L
V
V
minimum 1µF to GND
V
V
V
IN_ = V
IN_ = V
Switching at 250kHz, C
V
V
V
12V < V
V
V
V
12V < V
External resistive divider connected at
FB/SET
V
V
= T
CC
DRV
CC
CC
CC
CC
CC
CC
CC
CC
CC
FB
FB
DRV
= 1µF, FB/SET = GND)
CC
J
falling
= 4.5V (Note 3)
= V
rising
rising
falling
powered only, V
= V
= V
= 6.5V, I
= 4.5V, I
= 12V, I
= -40°C to +125°C, unless otherwise noted. Typical values are at T
+ 0.3V)
+ 0.3V)
decoupled with
CC
CC
CC
CC
REG
REG
REG
or GND
or GND
< 28V, 0 < I
< 28V
LOAD
= V
= V
= 10V, IN+ = V
LOAD
LOAD
CONDITIONS
DRV
DRV
= 0 to 100mA
= 100mA
= 50mA
Continuous Power Dissipation (T
Junction-to-Case Thermal Resistance (Note 1) ..............8.5°C/W
Junction-to-Case Thermal Resistance (Note 1) ..............8.5°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
(MAX15024B)
(MAX15024A)
REG
10-Pin TDFN, Single-Layer Board
(derate 18.5mW/°C above +70°C) ...........................1481.5mW
10-Pin TDFN, Multilayer Board
(derate 24.4mW/°C above +70°C) ...........................1951.2mW
LOAD
L
= 0F
=
CC
< 10mA
MAX15024B
MAX15024A
, IN- = GND
-125
MIN
1.10
6.5
4.5
6.5
4.5
3.0
9
A
= +70°C)
TYP
1.23
700
250
300
100
220
1.7
1.5
3.4
0.4
0.2
10
10
2
1
+125
MAX
1350
28.0
28.0
18.0
18.0
1.35
2.3
3.0
3.8
0.9
0.5
11
A
UNITS
= T
mA
mV
mV
mV
µA
µA
nA
µs
%
V
V
V
V
V
V
J
=