MAX15019AASA+T Maxim Integrated Products, MAX15019AASA+T Datasheet - Page 2

• Manufacturer Part Number: MAX15019AASA+T
• Description: IC MOSF DRVR HALF BRDG HS 8-SOIC
• Manufacturer: Maxim Integrated Products
• Type: High Side/Low Sider

Specifications of MAX15019AASA+T

• Configuration: Half Bridge
• Input Type: Non-Inverting
• Delay Time: 36ns
• Current - Peak: 3A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 125V
• Voltage - Supply: 8 V ~ 12.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
• Rise Time: 50 ns
• Fall Time: 40 ns
• Supply Voltage (min): 8 V
• Supply Current: 2.75 mA
• Maximum Power Dissipation: 1904 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Half Bridge
• Maximum Turn-off Delay Time: 36 ns
• Maximum Turn-on Delay Time: 36 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
IN_H, IN_L to GND .................................................-0.3V to +15V
DL to GND ..................................................-0.3V to (V
DH to HS.....................................................-0.3V to (V
BST to HS ...............................................................-0.3V to +15V
HS to GND (repetitive transient)..............................-5V to +130V
HS dv/dt to GND................................................................50V/ns
125V/3A, High-Speed,
Half-Bridge MOSFET Drivers
ELECTRICAL CHARACTERISTICS
(V
= 12V and T
* As per JEDEC Standard 51 (Single-Layer Board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
POWER SUPPLY
Operating Supply Voltage
V
V
BST Quiescent Supply Current
BST Operating Supply Current
UVLO (V
UVLO (BST to HS)
UVLO Hysteresis
LOGIC INPUT
Input-Logic High
Input-Logic Low
Logic-Input Hysteresis
DD
DD
DD
DD
_______________________________________________________________________________________
to GND ............................................................-0.3V to +15V
= V
Quiescent Supply Current
Operating Supply Current
BST
DD
PARAMETER
A
to GND)
= 8V to 12.6V, V
= +25°C.) (Note 1)
HS
= V
GND
V
V
SYMBOL
BST_UVLO
DD_UVLO
I
I
V
I
I
V
BSTQ
BSTO
DDQ
DDO
V
V
VDD
HYS
= 0V, T
IH
IL
A
IN_H and IN_L are
unconnected (no
switching)
f
no capacitive load
IN_H and IN_L are unconnected (no
switching)
f
capacitive load
V
V
MAX15018A/MAX15018B (CMOS)
MAX15019A/MAX15019B (TTL)
MAX15018A/MAX15018B (CMOS)
MAX15019A/MAX15019B (TTL)
MAX15018A/MAX15018B (CMOS)
MAX15019A/MAX15019B (TTL)
SW
SW
= T
DD
BST
DD
DD
J
= 500kHz, V
= 500kHz, V
rising
rising
= -40°C to +125°C, unless otherwise noted. Typical values are at V
+ 0.3V)
+ 0.3V)
CONDITIONS
DD
BST
Continuous Power Dissipation (T
Single and Multilayer Board
Operating Temperature .....................................-40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
= 12V,
- V
8-Pin SO-EP (derate 23.8mW/°C above +70°C)*..........1.904W
θ
JC
HS
...................................................................................6°C/W
= 12V, no
MAX15018A/
MAX15018B
MAX15019A/
MAX15019B
0.67 x
MIN
V
8.0
6.5
6.2
DD
2
A
= +70°C)
TYP
2.75
2.75
1.65
7.3
6.9
0.5
0.4
65
95
95
0.33 x
MAX
12.6
3.75
3.75
V
130
190
190
7.6
0.8
DD
8
DD
UNITS
= V
mA
mA
µA
µA
V
V
V
V
V
V
V
BST