MIC4468BWM Micrel Inc, MIC4468BWM Datasheet - Page 4

• Manufacturer Part Number: MIC4468BWM
• Description: IC DRIVER MOSF QUAD 1.2A 16-SOIC
• Manufacturer: Micrel Inc

Specifications of MIC4468BWM

• Configuration: Low-Side
• Input Type: AND
• Delay Time: 35ns
• Current - Peak: 1.2A
• Number Of Configurations: 4
• Number Of Outputs: 4
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Number Of Drivers: 4
• Driver Configuration: Non-Inverting
• Driver Type: Low Side
• Input Logic Level: CMOS
• Rise Time: 25ns
• Fall Time: 25ns
• Propagation Delay Time: 75ns
• Operating Supply Voltage (max): 18V
• Peak Output Current: 1.2mA
• Power Dissipation: 1W
• Output Resistance: 5Ohm
• Operating Supply Voltage (min): 4.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / RoHS Status: Not Compliant, Contains lead / RoHS non-compliant

MIC4467/4468/4469
Absolute Maximum Ratings
Supply Voltage
Input Voltage
Maximum Chip Temperature
Maximum Load Temperature
Operating Ambient Temperature
Electrical Characteristics:
Note 3.
MIC4467/4468/4469
Symbol
INPUT
V
V
I
OUTPUT
V
V
R
I
I
SWITCHING TIME
t
t
t
t
POWER SUPPLY
I
IN
PK
R
F
D1
D2
S
Operating
Storage
(10 sec, for soldering)
C Version
B Version
IH
IL
OH
OL
O
Specification for packaged product only.
Logic 1 Input Voltage
Logic 0 Input Voltage
Input Current
High Output Voltage
Low Output Voltage
Output Resistance
Peak Output Current
Latch-Up Protection
Withstand Reverse Current
Rise Time
Fall Time
Delay Time
Delay Time
Power Supply Current
Supply
Parameter
(GND – 5V) to (V
Measured at T
(Notes 1 and 2)
–65° to +150°C
–40° to +85°C
Conditions
0 ≤ V
I
I
I
Test Figure 1
Test Figure 1
Test Figure 1
Test Figure 1
LOAD
LOAD
OUT
0° to +70°C
= 10mA, V
S
= 10mA
= 10mA
IN
+ 0.3V)
A
150°C
300°C
≤ V
= 25°C with 4.5V ≤ V
22V
S
S
= 18V
4
Power Dissipation
Package Thermal Resistance
N Package (14-Pin Plastic DIP)
WM Package (16-Pin Wide SOIC)
N Package (14-Pin Plastic DIP) θ
WM Package (16-Pin Wide SOIC) θ
S
≤ 18V unless otherwise specified. (Note 3)
V
>500
S
Min
2.4
-0.15
–1
Typ
1.3
1.2
1.2
0.2
14
13
30
45
5
JA
JA
Max
0.15
0.8
15
25
25
75
75
1
4
Micrel, Inc.
July 2005
120°C/W
80°C/W
Units
mA
mA
µA
ns
ns
ns
ns
Ω
1.5W
V
V
V
V
A
1W