LTC4440ES6#TR Linear Technology, LTC4440ES6#TR Datasheet - Page 6

• Manufacturer Part Number: LTC4440ES6#TR
• Description: IC DRIVER HIGHSIDE HS/HV SOT23-6
• Manufacturer: Linear Technology
• Type: High Sider

Specifications of LTC4440ES6#TR

• Input Type: Non-Inverting
• Number Of Outputs: 1
• On-state Resistance: 1.5 Ohm
• Current - Output / Channel: 2.4A
• Current - Peak Output: 4A
• Voltage - Supply: 8 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-6
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

PI FU CTIO S
BLOCK DIAGRA
LTC4440
Exposed Pad MS8E Package
INP (Pin 1): Input Signal. TTL/CMOS compatible input
referenced to GND (Pin 2).
GND (Pins 2, 4): Chip Ground.
V
side circuitry. A low ESR ceramic bypass capacitor should
be tied between this pin and the GND pin (Pin 2).
NC (Pin 5): No Connect. No connection required. For
convenience, this pin may be tied to Pin 6 (BOOST) on the
application board.
6
TI I G DIAGRA
CC
U
W
(Pin 3): Chip Supply. This pin powers the internal low
U
U
8V TO 15V
U
W
V
GND
INP
W
CC
UNDERVOLTAGE
OUTPUT (TG)
LOCKOUT
INPUT (INP)
UNDERVOLTAGE
V
INPUT RISE/FALL TIME < 10ns
HIGH SIDE
LOCKOUT
IH
t
PLH
t
r
LEVEL SHIFTER
GND
BOOST (Pin 6): High Side Bootstrapped Supply. An exter-
nal capacitor should be tied between this pin and TS
(Pin 8). Normally, a bootstrap diode is connected between
V
V
drop of the bootstrap diode.
TG (Pin 7): High Current Gate Driver Output (Top Gate).
This pin swings between TS and BOOST.
TS (Pin 8): Top (High Side) Source Connection.
Exposed Pad (Pin 9): Ground. Must be electrically con-
nected to Pins 2 and 4 and soldered to PCB ground for
optimum thermal performance.
CC
CC
– V
(Pin 3) and this pin. Voltage swing at this pin is from
t
PHL
BOOST
TS
D
V
t
IL
to V
f
IN
90%
10%
+ V
4440 TD
BOOST
CC
– V
TG
TS
D
, where V
UP TO 100V
UP TO 80V,
TRANSIENT
D
V
is the forward voltage
IN
4440 BD
4440f