VNS1NV04-E STMicroelectronics, VNS1NV04-E Datasheet
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VNS1NV04-E
Specifications of VNS1NV04-E
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VNS1NV04-E Summary of contents
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... ON I 1.7 A LIMH CLAMP Description The VND1NV04, VNN1NV04, VNS1NV04 are monolithic devices designed in STMicroelectronics VIPower M0-3 Technology, intended for replacement of standard Power MOSFETs from KHz applications. Built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. Fault feedback can be detected by monitoring the voltage at the input pin ...
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... SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1 DPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.2 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.3 SO8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.4 DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.5 SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.6 SO8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 VND1NV04 - VNN1NV04 - VNS1NV04 Doc ID 7381 Rev 2 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Thermal data Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. DPAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 6. SOT-223 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 7. SO-8 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 8. DPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 9. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 10. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 ...
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... Figure 43. SOT-223 mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 44. SO-8 package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 45. SOT-223 tape and reel shipment (suffix “TR” Figure 46. SO-8 tube shipment (no suffix Figure 47. SO-8 tape and reel shipment (suffix “TR” 4/33 VND1NV04 - VNN1NV04 - VNS1NV04 Doc ID 7381 Rev 2 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 1 Block diagram and pin description Figure 1. Block diagram INPUT 1 Figure 2. Configuration diagram (top view) a. For the pins configuration related to SOT-223 and DPAK see outline at page 1. Gate Control Over Temperature (a) 1 SOURCE 8 SOURCE SOURCE 4 5 INPUT Doc ID 7381 Rev 2 ...
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... Operating junction temperature j T Case operating temperature c T Storage temperature stg 6/33 DRAIN R IN INPUT SOURCE Parameter =0 V) INn =25 °C c Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 Value SOT-223 SO-8 DPAK Internally clamped Internally clamped +/-20 330 Internally limited -3 4000 16500 7 8.3 35 Internally limited ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 2.2 Thermal data Table 3. Thermal data Symbol R Thermal resistance junction-case thj-case R Thermal resistance junction-lead thj-lead R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR4 board with all DRAIN pins 2.3 Electrical characteristics Table 4. Electrical characteristics Symbol Parameter Off (-40 ° ...
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... = = Starting T =25 ° gen IN MIN L=50 mH (see Figure 6 and Figure Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 Min Typ Max 70 200 170 500 =330 Ω 350 1000 200 600 0.25 1.0 1.3 4.0 1.8 5.5 1.2 4.0 5 =330 Ω 0.8 205 100 0 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Figure 4. Switching time test circuit for resistive load gen 90 10 d(on) d(off) Doc ID 7381 Rev 2 Electrical specifications gen V gen 9/33 ...
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... Electrical specifications Figure 5. Test circuit for diode recovery times 330Ω Figure 6. Unclamped inductive load test circuits 10/ FAST OMNIFET DIODE gen I V gen R GEN Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 A L=100uH OMNIFET S 8.5 Ω ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Figure 7. Input charge test circuit Figure 8. Unclamped inductive waveforms V GEN IN Doc ID 7381 Rev 2 Electrical specifications ND8003 11/33 ...
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... Id=1.5A 2 Id=1A 1.5 Id=1.5A Id= 5.5 6 6.5 Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 Tj=-40ºC Vin=2.5V Tj=25ºC Tj=150ºC 0.05 0.1 0.15 0.2 0.25 0.3 Id(A) vs. input voltage (part 1/2) Id=0.5A Tj=150ºC Tj=25ºC Tj=-40ºC 3 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Figure 15. Static drain-source on resistance vs. Id Rds(on) (mohms) 500 450 Tj=150ºC 400 350 300 250 Tj=25ºC 200 150 Tj=-40ºC 100 0.25 0.5 0.75 1 1.25 Id(A) Figure 17. Turn-on current slope (part 1/2) di/dt(A/us 500 1000 1500 Rg(ohm) Figure 19 ...
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... Vdd=15V Id=0.5A 150 125 100 2000 2500 Figure 24. Switching time resistive load tr tf td(on) Figure 26. Normalized on resistance vs. Vin=5.5V Vin=4.5V Vin=3.5V Vin= Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 f=1MHz Vin= Vds(V) (part 2/2) t(ns) 550 500 Vdd=15V tr 450 Id=0.5A Rg=330ohm 400 350 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Figure 27. Normalized input threshold voltage vs. temperature Vinth (V) 2 1.8 Vds=Vin 1.6 Id=1mA 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -50 - (ºC) Figure 29. Step response current limit Tdlim(us) 2.4 2.3 Rg=330ohm 2.2 2 Vdd(V) Figure 28. Normalized current limit vs. ...
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... When the current limiter is D lim through the input pin in order to indicate fault condition. If driven from the input pin will fall This will not however affect the gf Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 > the device tries to sink a j jsh . ISS jsh. ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 4 Package and PCB thermal data 4.1 DPAK thermal data Figure 30. DPAK PC board 1. Layout condition thickness=35 µm , Copper areas: from minimum pad layout Figure 31. DPAK and Z measurements (PCB FR4 area = mm,PCB thickness = 2 mm vs. PCB copper area in open box free air condition ...
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... Figure 32. DPAK thermal impedance junction ambient single pulse ZTH ( ° 100 10 1 0,1 0,0001 0,001 Equation 1: pulse calculation formula ⋅ δ THδ TH where δ Figure 33. DPAK thermal fitting model of a single channel 18/33 0,01 0,1 1 Time ( δ – THtp Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 Footprint 10 100 1000 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Table 5. DPAK thermal parameter Area/island (cm R1 (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W·s/°C) C2 (W·s/°C) C3 (W·s/°C) C4 (W·s/°C) C5 (W·s/°C) C6 (W·s/°C) 4.2 SOT-223 thermal data Figure 34. SOT-223 PC board 1. Layout condition thickness=35 µ ...
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... ZTH ( ° 1000 100 10 1 0,1 0,0001 0,001 20/33 vs. PCB copper area in open box free air condition thj-amb footprint 0,5 1 PCB Cu heat sink area ( cm refer t o PCB layout ) 0,01 0,1 1 Time ( s) Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 1,5 2 Footprint 10 100 1000 2 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Equation 2: pulse calculation formula ⋅ δ THδ TH where δ Figure 37. SOT-223 thermal fitting model of a single channel Table 6. SOT-223 thermal parameter Area/island (cm R1 (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W·s/°C) C2 (W·s/°C) C3 (W·s/°C) C4 (W· ...
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... Cu thickness=35 µm , Copper areas: from minimum pad layout Figure 39. SO-8 R 105 22/33 and Z measurements (PCB FR4 area = mm,PCB thickness = 2 mm vs. PCB copper area in open box free air condition thj-amb footprint 0,5 1 PCB Cu heat sink area ( cm refer t o PCB layout ) Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 2 ). 1,5 2 2,5 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Figure 40. SO-8 thermal impedance junction ambient single pulse ZTH (° 1000 100 10 1 0,1 0,0001 Equation 3: pulse calculation formula ⋅ δ THδ TH where δ Figure 41. SO-8 thermal fitting model of a single channel 0,001 0,01 0,1 Time ( δ – ...
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... SO-8 thermal parameter Area/island (cm R1 (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W·s/°C) C2 (W·s/°C) C3 (W·s/°C) C4 (W·s/°C) C5 (W·s/°C) C6 (W·s/°C) 24/33 VND1NV04 - VNN1NV04 - VNS1NV04 0.8 2.6 3 0.00006 0.0005 0.0075 0.045 0.35 1.05 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 5 Package and packing information In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.1 DPAK mechanical data Figure 42 ...
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... Package and packing information Table 8. DPAK mechanical data Dim Package weight 26/33 VND1NV04 - VNN1NV04 - VNS1NV04 mm. Min. Typ. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 5.1 6.40 4.7 2.28 4.40 9.35 0.8 0.60 0.2 0° 8° Gr. 0.29 Doc ID 7381 Rev 2 Max. ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 5.2 SOT-223 mechanical data Figure 43. SOT-223 mechanical data & package outline 5.3 SO8 mechanical data Table 9. SO-8 mechanical data Dim Package and packing information mm Min. Typ. 0.10 1.25 Doc ID 7381 Rev 2 Max. 1.75 0.25 27/33 ...
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... Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0. total (both side). 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. Figure 44. SO-8 package dimension 28/33 VND1NV04 - VNN1NV04 - VNS1NV04 mm Min. Typ. 0.28 0.17 4 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 5.4 DPAK packing information The devices can be packed in tube or tape and reel shipments (see the page 1 ). DPAK FOOTPRINT TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter ...
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... P0 (± 0. 0.1/-0) 1.5 D1 (min) 1.5 F (± 0.05) 5.5 K (max) 4.5 P1 (± 0.1) 2 End Top cover tape Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 Reel dimensions Base Q.ty 1000 Bulk Q.ty 1000 A (max) 330 B (min) 1.5 C (± -0) 12.4 N (min (max) 18.4 ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 5.6 SO8 packing information Figure 46. SO-8 tube shipment (no suffix) Figure 47. SO-8 tape and reel shipment (suffix “TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter ...
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... Revision history 6 Revision history Table 10. Document revision history Date Feb-2003 16-Apr-2009 32/33 Revision 1 Initial release. Added Table 1: Device summary on page 1 and PCB thermal data 2 Updated Section 5: Package and packing information on page 25 Doc ID 7381 Rev 2 VND1NV04 - VNN1NV04 - VNS1NV04 Changes and Section 4: Package ...
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... VND1NV04 - VNN1NV04 - VNS1NV04 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...