VND830ASP STMicroelectronics, VND830ASP Datasheet
VND830ASP
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VND830ASP Summary of contents
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... OVERVOLTAGE UNDERVOLTAGE PwCLAMP 1 DRIVER 1 I LIM1 V dslim1 LOGIC I OUT1 K PwCLAMP 2 DRIVER 2 Ot1 I LIM2 V dslim2 I Ot2 OUT2 K VND830ASP 10 1 PowerSO-10™ ORDER CODES TUBE T&R VND830ASP VND830ASP13TR pin voltage OUTPUT 1 Ot1 CURRENT SENSE 1 OUTPUT 2 Ot2 CURRENT SENSE 2 1/17 ...
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... VND830ASP ABSOLUTE MAXIMUM RATING Symbol V DC Supply Voltage CC -V Reverse Supply Voltage Reverse Ground Pin Current GND I Output Current OUT I Reverse Output Current R I Input Current IN V Current Sense Maximum Voltage CSENSE Electrostatic Discharge (Human Body Model: R=1.5 ; C=100pF) - INPUT V - CURRENT SENSE ...
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... V OUT R =6.5 from V falling edge =11.7V OUT R =6.5 from V =1. OUT R =6.5 from V =11. OUT Test Conditions V =1.25V IN V =3.25V IN I =1mA IN I =-1mA IN VND830ASP Value 1.2 51.2 (*) <150°C, unless otherwise specified) Min Typ Max 5 5 120 = =0V =0A; OUT - ...
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... VND830ASP ELECTRICAL CHARACTERISTICS (continued OUTPUT DIODE CC Symbol Parameter V Forward on Voltage F PROTECTIONS Symbol Parameter I Current limitation lim Thermal shut-down T TSD temperature T Thermal reset temperature R T Thermal hysteresis HYST V Turn-off output voltage clamp I demag V Output voltage drop limitation I ON CURRENT SENSE (9V V 16V) (See figure 1) ...
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... TEST LEVELS II III -50 V -75 V +50 V +75 V -50 V -100 V + +46.5 V +66.5 V TEST LEVELS RESULTS CONTENTS VND830ASP SENSE 0 Nominal 0 V SENSEH < TSD (T > TSD SENSEH 0 < Nominal 0 IV Delays and Impedance -100 +100 V 0 -150 V 0 +100 V 0 100 ms, 0.01 +86.5 V ...
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... VND830ASP Figure versus I OUT SENSE OUT Iout/Isense 2250 2000 1750 1500 1250 1000 750 500 0 Figure 2: Switching Characteristics (Resistive load R V OUT 80% dV /dt OUT (on) I SENSE 90% t DSENSE INPUT t d(on) 6/ Tj=25...150º Tj=25...150ºC 0.5 1 1.5 Iout (A) =6 90% ...
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... LOAD CURRENT n SENSE INPUT n LOAD CURRENT n SENSE n INPUT n LOAD CURRENT n LOAD VOLTAGE n SENSE n INPUT n LOAD VOLTAGE n LOAD CURRENT n SENSE TSD INPUT n LOAD CURRENT n SENSE n NORMAL OPERATION UNDERVOLTAGE V USDhyst OVERVOLTAGE OV V > V < SHORT TO GROUND SHORT <Nominal OVERTEMPERATURE VND830ASP <Nominal V SENSEH I = SENSE R SENSE 7/17 ...
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... VND830ASP APPLICATION SCHEMATIC +5V R prot R prot C R prot R prot R R SENSE1 GND PROTECTION NETWORK REVERSE BATTERY Solution 1: Resistor in the ground line (R can be used with any type of load. The following is an indication on how to dimension the R resistor. GND 1) R 600mV / I . GND S(on)max (-I ) GND ...
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... C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os CCpeak latchup prot Calculation example: ) For 100V and I prot CCpeak latchup 5k R 65k . prot Recommended R value is 10k prot VND830ASP ( GND IHmax 20mA 9/17 ...
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... VND830ASP Off State Output Current IL(off1) (uA Off state 6 Vcc=13V Vin=Vout= -50 - 100 Tc (ºC) Input Clamp Voltage Vicl (V) 8 7.8 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - 100 Tc (ºC) Input Low Level Vil (V) 2.6 2.4 Vcc=13V 2.2 2 1.8 1.6 1.4 1.2 ...
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... On State Resistance Vs V Ron (mOhm) 100 125 150 175 5 VND830ASP Vcc=13V - 100 125 150 Tc (ºC) Vcc=13V Rl=6.5Ohm - 100 125 150 Tc (ºC) CC Tc=150ºC Iout=5A Tc=25ºC Tc= -40º ...
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... VND830ASP Maximum turn off current versus load inductance I LMAX (A) 100 Single Pulse at T =150ºC Jstart B= Repetitive pulse at T =100ºC Jstart C= Repetitive Pulse at T =125ºC Jstart Conditions: V =13.5V CC Values are generated with case of repetitive pulses, T jstart the temperature specified above for curves B and C. ...
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... PowerSO-10™ PC Board Layout condition of R and thickness=35 m, Copper areas: from minimum pad lay-out to 8cm R Vs PCB copper area in open box free air condition thj-amb RTHj_amb (°C/ measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm PCB Cu heatsink area (cm^2) VND830ASP 2 ). Tj-Tamb=50° 13/17 ...
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... VND830ASP PowerSO-10 Thermal Impedance Junction Ambient Single Pulse ZTH (°C/W) 1000 100 10 1 0.1 0.0001 0.001 0.01 Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 C1 C2 Tj_2 R1 R2 Pd2 T_amb 14/17 0 Time (s) Pulse calculation formula where Thermal Parameter Area/island (cm R1 (° ...
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... B 0. SEATING PLANE DETAIL "A" DETAIL "A" VND830ASP inch MIN. TYP. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.0126 0.370 0.291 0.366 0.283 0.287 0.232 0.232 0.050 0.049 0.047 0.543 0.545 0.002 ...
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... VND830ASP SUGGESTED PAD LAYOUT PowerSO-10™ 14.6 - 14 TAPE AND REEL SHIPMENT (suffix “13TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width W Tape Hole Spacing P0 (± 0.1) Component Spacing P Hole Diameter D (± 0.1/-0) ...
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