VNQ830M STMicroelectronics, VNQ830M Datasheet - Page 8

IC DRIVER HISIDE QUAD 28-SOIC

VNQ830M

Manufacturer Part Number
VNQ830M
Description
IC DRIVER HISIDE QUAD 28-SOIC
Manufacturer
STMicroelectronics
Type
High Sider
Datasheet

Specifications of VNQ830M

Input Type
Non-Inverting
Number Of Outputs
4
On-state Resistance
60 mOhm
Current - Peak Output
10.5A
Voltage - Supply
5.5 V ~ 36 V
Mounting Type
Surface Mount
Package / Case
28-SOIC (7.5mm Width)
Supply Current
40 mA
Maximum Power Dissipation
6250 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Current - Output / Channel
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Electrical specifications
2.2
2.3
Note:
8/28
Thermal data
Table 4.
1. When mounted on a standard single-sided FR-4 board with 0.5cm
2. When mounted on a standard single-sided FR-4 board with 6cm
Electrical characteristics
Values specified in this section are for 8V < V
otherwise stated.
Figure 3.
V
Fn
Symbol
R
R
R
to all V
all V
thj-lead
thj-amb
thj-amb
= V
CC
V
CCn
CC3,4
CC
pins. Horizontal mounting and no artificial air flow.
V
IN1
pins. Horizontal mounting and no artificial air flow.
Thermal resistance junction-lead per chip
Thermal resistance junction-ambient
(one chip ON)
Thermal resistance junction-ambient
(two chips ON)
- V
V
Thermal data (per island)
Current and voltage conventions
STAT1
OUTn
V
IN2
V
STAT2
V
during reverse battery condition.
IN3
V
STAT3
I
S3,4
V
IN4
V
STAT4
I
I
I
I
I
I
I
I
IN1
STAT1
IN2
IN3
STAT4
STAT2
STAT3
IN4
Parameter
INPUT1
STATUS1
INPUT2
STATUS2
INPUT3
INPUT4
STATUS4
STATUS3
GND
V
CC3,4
CC
3,4
I
GND3,4
< 36V; -40°C < T
V
OUTPUT3
OUTPUT4
OUTPUT1
OUTPUT2
CC1,2
GND
2
of Cu (at least 35 µm thick) connected to
1,2
2
of Cu (at least 35 µm thick) connected
I
GND1,2
60
46
I
I
I
V
I
OUT1
OUT4
OUT2
OUT3
OUT4
(1)
(1)
j
< 150°C, unless
V
V
Value
OUT3
F1
20
(*)
I
V
S1,2
OUT2
44
31
V
(2)
(2)
OUT1
V
VNQ830M
CC1,2
°C/W
°C/W
°C/W
Unit

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