MDC3105LT1 ON Semiconductor, MDC3105LT1 Datasheet - Page 13

• Manufacturer Part Number: MDC3105LT1
• Description: IC RELAY/DRVR INDUCT LOAD SOT23
• Manufacturer: ON Semiconductor
• Type: Relay/Load Driverr

Specifications of MDC3105LT1

• Input Type: Non-Inverting
• Number Of Outputs: 1
• Current - Output / Channel: 400mA
• Current - Peak Output: 500mA
• Voltage - Supply: 6V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• On-state Resistance: -
• Lead Free Status / Rohs Status: Not Compliant
• Other names: MDC3105LT1OSTR

0.05 (0.002)
H
E
e
A1
*For additional information on our Pb−Free strategy and soldering
0.028
0.7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
6
1
D
5
2
0.074
1.9
3
4
SOLDERING FOOTPRINT*
b
0.039
A
E
1.0
0.094
PACKAGE DIMENSIONS
2.4
http://onsemi.com
L
CASE 318F−05
ISSUE M
SCALE 10:1
SC−74
C
13
q
inches
0.037
0.037
mm
0.95
0.95
STYLE 8:
NOTES:
PIN 1. EMITTER 1
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. 318F−01, −02, −03, −04 OBSOLETE. NEW
DIM
H
A1
A
b
c
D
E
e
L
q
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
STANDARD 318F−05.
E
2. BASE 2
3. COLLECTOR 2
4. EMITTER 2
5. BASE 1
6. COLLECTOR 1
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MILLIMETERS
NOM
1.00
0.06
0.37
0.18
3.00
1.50
0.95
0.40
2.75
−
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.051
0.034
0.008
0.099
0.114
MIN
0°
INCHES
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
NOM
−
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°