L6234PD STMicroelectronics, L6234PD Datasheet - Page 2

• Manufacturer Part Number: L6234PD
• Description: IC MOTOR DRIVER 3-PH 20-SOIC
• Manufacturer: STMicroelectronics
• Type: Driverr

Specifications of L6234PD

• Applications: DC Motor Driver, Brushless (BLDC), 3 Phase
• Number Of Outputs: 1
• Current - Output: 4A
• Voltage - Supply: 7 V ~ 52 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: PowerSO-20 Exposed Bottom Pad
• Operating Temperature Classification: Automotive
• Package Type: PowerSO
• Operating Supply Voltage (min): 7V
• Operating Supply Voltage (typ): 42V
• Operating Supply Voltage (max): 52V
• Operating Supply Voltage: 7 V to 52 V
• Supply Current: 0.007 A
• Mounting Style: SMD/SMT
• Current, Output, High Level: 5 A (Pulsed)
• Power Dissipation: 2.3 W
• Temperature, Operating, Maximum: 150 °C
• Temperature, Operating, Minimum: -40 °C
• Voltage, Input, High Level: 7 V
• Voltage, Input, Low Level: -0.3 V
• Voltage, Supply: 52 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-2944-5

THERMAL DATA
THERMAL CHARACTERISTICS
R
DIP16+2+2. The thermal resistance is referred to
the thermal path from the dissipating region on
the top surface of the silicon chip, to the points
along the four central pins of the package, at a
distance of 1.5 mm away from the stand-offs.
R
If a dissipating surface, thick at least 35 m, and
with a surface similar or bigger than the one
shown, is created making use of the printed cir-
cuit.
Such heatsinking surface is considered on the
bottom side of an horizontal PCB (worst case).
R
If the power dissipating pins (the four central
Figure 1: Printed Heatsink
th j-pins
th j-amb1
th j-amb2
R
R
Symbol
R
R
th j-amb1
th j-amb2
th j-case
th j-pin
Thermal Resistance, Junction to Pin
Thermal Resistance, Junction to Ambient
(see Thermal Characteristics)
Thermal Resistance, Junction to Ambient (see Thermal
Characteristics)
Thermal Resistance Junction-case
Parameter
ones), as well as the others, have a minimum
thermal connection with the external world (very
thin strips only) so that the dissipation takes place
through still air and through the PCB itself.
It is the same situation of point above, without any
heatsinking surface created on purpose on the
board.
Additional data on the PowerDip and the
PowerSO20 package can be found in:
Application Note AN467:
Thermal Characteristics of the PowerDip
20,24 Packages Soldered on 1,2,3 oz.
Copper PCB
Application Note AN668:
A New High Power IC Surface Mount Package:
PowerSO20 Power IC Packaging from Insertion
to Surface Mounting.
DIP16+2+2
12
40
50
–
PowerSO20
1.5
–
–
–
L6234
Unit
C/W
C/W
C/W
C/W
3/10