IR3505ZMTRPBF International Rectifier, IR3505ZMTRPBF Datasheet - Page 18

• Manufacturer Part Number: IR3505ZMTRPBF
• Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3505ZMTRPBF

• Package / Case: 16-MLPQ
• Mounting Type: Surface Mount
• Current - Supply: 3mA
• Voltage - Supply: 8 V ~ 16 V
• Operating Temperature: 0°C ~ 125°C
• Applications: Processor
• Supply Voltage Range: 4.75V To 7.5V, 8V To 16V
• Operating Temperature Range: 0°C To +125°C
• Digital Ic Case Style: MLPQ
• No. Of Pins: 16
• Termination Type: SMD
• Function: For High Performance CPUs And ASICs
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Controller Type: XPhase
• Package: 16-Lead MLPQ
• Circuit: X-Phase Phase IC
• Iout (a): 2.5A Gate Driver
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Solder Resist
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
• The minimum solder resist width is 0.13mm.
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect
• The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder
Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
fillet so a solder resist width of ≥ 0.17mm remains.
copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable to have
the solder resist opening for the land pad to be smaller than the part pad.
ratio of the solder resist strip separating the lead lands from the pad land.
Page 18 of 20
March 17, 2009
IR3505Z