MAX1931EUB+T Maxim Integrated Products, MAX1931EUB+T Datasheet - Page 7

• Manufacturer Part Number: MAX1931EUB+T
• Description: IC SW CUR LIMIT USB 10-UMAX
• Manufacturer: Maxim Integrated Products

Specifications of MAX1931EUB+T

• Applications: USB, Peripherals
• Current - Supply: 14µA
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

spurious FAULT output. Load-transient faults less than
10ms (typ) do not cause a FAULT output assertion.
Only current-limit faults are blanked. Die overtempera-
ture faults and input voltage droops below the UVLO
threshold cause an immediate fault output.
To limit the input voltage drop during momentary output
short-circuit conditions, connect a capacitor from IN to
GND. A 1µF ceramic capacitor is adequate for most
applications; however, higher capacitor values further
reduce the voltage drop at the input (see Figure 2).
Connect a 0.1µF capacitor from OUT to GND. This cap-
acitor helps prevent inductive parasitics from pulling
OUT negative during turn-off.
To optimize the switch-response time to output short-
circuit conditions, it is very important to keep all traces
as short as possible to reduce the effect of undesirable
parasitic inductance. Place input and output capacitors
as close to the device as possible (no more than 5mm).
Figure 2. Typical Application Circuit
2.7V TO 5.5V
1µF
*USB SPECIFICATIONS REQUIRE A LARGER CAPACITOR
INPUT
ON
OFF
Current-Limited Switch for Single USB Port
Layout and Thermal Dissipation
100kΩ
Applications Information
_______________________________________________________________________________________
IN
FAULT
ON
MAX1931
GND
Output Capacitor
Input Capacitor
OUT
0.1µF*
OUTPUT
All IN and all OUT pins must be connected with short
traces to the power bus. Wide power bus planes pro-
vide superior heat dissipation through the switch IN and
OUT pins. Figure 3 shows suggested pin connections
for a single-layer board.
Under normal operating conditions, the package can
dissipate and channel heat away. Calculate the maxi-
mum power dissipation as follows:
where I
R
When the output is short-circuited, foldback-current-lim-
iting activates and the voltage drop across the switch
equals the input supply. The power dissipated across
the switch increases, as does the die temperature. If the
fault condition is not removed, the thermal-overload pro-
tection circuitry activates (see the Thermal Shutdown
section). Wide power-bus planes connected to IN and
OUT and a ground plane in contact with the device
help dissipate additional heat.
TRANSISTOR COUNT: 715
Figure 3. IN and OUT Cross Connections for a Single-Layer
Board
ON
is the on-resistance of the switch (150mΩ max).
LIMIT
1
2
3
4
5
is the preset current limit (1.1A max) and
P = (I
IN
OUT
IN
OUT
ON
LIMIT
MAX1931
Chip Information
)
2
✕
FAULT
R
GND
OUT
OUT
ON
IN
10
9
8
7
6
7