TMP04FT9Z Analog Devices Inc, TMP04FT9Z Datasheet - Page 15

• Manufacturer Part Number: TMP04FT9Z
• Description: IC SENSOR TEMP/SERIAL TO-92-3
• Manufacturer: Analog Devices Inc

Specifications of TMP04FT9Z

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Digital Modulator
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 100°C
• Output Type: CMOS/TTL
• Output Alarm: No
• Output Fan: No
• Voltage - Supply: 4.5 V ~ 7 V
• Operating Temperature: -55°C ~ 150°C
• Mounting Type: Through Hole
• Package / Case: TO-92-3 (Standard Body), TO-226
• Ic Output Type: Digital
• Sensing Accuracy Range: ± 1.5°C
• Supply Current: 1.3A
• Supply Voltage Range: 4.5V To 7V
• Resolution (bits): 16bit
• Sensor Case Style: TO-92
• No. Of Pins: 3
• Temperature Sensor Function: Temp Sensor
• Interface Type: Serial (1-Wire)
• Package Type: TO-92
• Operating Temperature (min): -55
• Operating Temperature (max): 150C
• Operating Temperature Classification: Military
• Operating Supply Voltage (typ): 5V
• Accuracy: ± 3
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Monitoring Electronic Equipment
The TMP03 are ideal for monitoring the thermal environment
within electronic equipment. For example, the surface-mounted
package will accurately reflect the exact thermal conditions which
affect nearby integrated circuits. The TO-92 package, on the
other hand, can be mounted above the surface of the board, to
measure the temperature of the air flowing over the board.
The TMP03 and TMP04 measure and convert the temperature
at the surface of their own semiconductor chip. When the TMP03
are used to measure the temperature of a nearby heat source,
the thermal impedance between the heat source and the TMP03
must be considered. Often, a thermocouple or other tempera-
ture sensor is used to measure the temperature of the source
5V
2
1
TMP04
GND
V+
5V
D
OUT
0.1 F
3
4
5
1
2
74HC08
CLOCK
1MHZ
10 F
3
6
5V
5V
20
11
16
2
1
LE
D1 D2 D3 D4
Q0 Q1 Q2 Q3
EN
CLK
Q1 Q2 Q3 Q4
V CC
V CC
2 5 6 9
3 4 7 8
3 4 5 6
CLK GND RESET RESET
10k
9
74HC4520 #1
74HC373
8
4
5
74HC86
EN
10pF
10
D5 D6 D7 D8
Q0 Q1 Q2 Q3
Q5 Q6 Q7 Q8
12 15 16 19
13 14 17 18
11 12 13 14
7
T1 DATA (MICROSECONDS)
5V
6
GND
OUT
15
4
5
3
10
1
CLR
A
B
T1
GND
20pF
5V
5V
20
11
16
2
8
T2
V
LE
D1 D2 D3 D4
EN
CC
Q1 Q2 Q3 Q4
V CC
Q0 Q1 Q2 Q3
V CC
CLK
Q
Q
3 4 7 8
3 4 5 6
2 5 6 9
1k
1
74HC4538
16
6
7
CLK GND RESET RESET
NC
9
74HC373
74HC4520 #2
5V
8
EN
10
D5 D6 D7 D8
Q5 Q6 Q7 Q8
Q0 Q1 Q2 Q3
12 15 16 19
13 14 17 18
11 12 13 14
12
11
13
7
while the TMP03 temperature is monitored by measuring T1
and T2. Once the thermal impedance is determined, the tem-
perature of the heat source can be inferred from the TMP03
output.
One example of using the TMP04 to monitor a high power
dissipation microprocessor or other IC is shown in Figure 13.
The TMP04, in a surface mount package, is mounted directly
beneath the microprocessor’s pin grid array (PGA) package. In
a typical application, the TMP04’s output would be connected
to an ASIC where the pulsewidth would be measured (see the
Hardware Interface section of this data sheet for a typical inter-
face schematic). The TMP04 pulse output provides a significant
A
B
CLR
GND
OUT
T1
15
15
20pF 3.9k
GND
10
1
8
T2
14
Q
Q
5V
10
20
11
9
5V
NC
Q1 Q2 Q3 Q4
LE
D1 D2 D3 D4
V CC
3 4 7 8
2 5 6 9
74HC373
D5 D6 D7 D8
Q5 Q6 Q7 Q8
12 15 16 19
13 14 17 18
T2 DATA (MICROSECONDS)
GND
OUT
10
1
5V
TMP03/TMP04
11
20
LE
D1 D2 D3 D4
Q1 Q2 Q3 Q4
V CC
3 4 7 8
2 5 6 9
74HC373
Q5 Q6 Q7 Q8
D5 D6 D7 D8
12 15 16 19
13 14 17 18
OUT
GND
10
1