AD7817ARZ Analog Devices Inc, AD7817ARZ Datasheet - Page 17

• Manufacturer Part Number: AD7817ARZ
• Description: IC ADC 10BIT 4CH W/TEMP 16-SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD7817ARZ

• Function: Temp Monitoring System (Sensor)
• Topology: ADC, Multiplexer, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 85°C
• Output Type: MICROWIRE™, QSPI™, SPI™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Resolution (bits): 10bit
• Sampling Rate: 100kSPS
• Input Channel Type: Single Ended
• Data Interface: Serial
• Supply Voltage Range - Analog: 2.7V To 5.5V
• Supply Current: 1.6mA
• Digital Ic Case Style: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-AD7816/7/8EB - BOARD EVALUATION FOR AD7816/7/8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

REV. C
0.25 (0.0098)
0.10 (0.0039)
D
COPLANARITY
4.00 (0.1575)
3.80 (0.1496)
0.25 (0.0098)
0.10 (0.0040)
RD/WR
IN
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COPLANARITY
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
SCLK
/D
16-Lead Standard Small Outline Package [SOIC]
4.00 (0.1574)
3.80 (0.1497)
OUT
8-Lead Standard Small Outline Package [SOIC]
0.10
0.10
Dimensions shown in millimeters and (inches)
Dimensions shown in millimeters and (inches)
16
1
COMPLIANT TO JEDEC STANDARDS MS-012AA
COMPLIANT TO JEDEC STANDARDS MS-012AC
1.27 (0.0500)
SEATING
10.00 (0.3937)
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
PLANE
9.80 (0.3858)
8
1
BSC
t
5
BSC
0.51 (0.0201)
0.31 (0.0122)
1
DB7
5
4
0.51 (0.0201)
0.31 (0.0122)
t
Narrow Body
Narrow Body
6
1.75 (0.0689)
1.35 (0.0531)
6.20 (0.2440)
5.80 (0.2284)
8
9
1.75 (0.0688)
1.35 (0.0532)
2
(R-16)
DB6
(R-8)
SEATING
PLANE
6.20 (0.2441)
5.80 (0.2283)
Figure 21. AD7816/AD7818 Serial Interface Timing Diagram
t
3
CONTROL BYTE
0.25 (0.0098)
0.17 (0.0067)
7
DB5
0.25 (0.0098)
0.17 (0.0067)
8
0
8
0
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
t
7
0.50 (0.0197)
0.25 (0.0098)
8
1.27 (0.0500)
0.40 (0.0157)
DB1
t
9
OUTLINE DIMENSIONS
8
DB0
45
45
–17–
t
12
0.15
0.05
t
11
16-Lead Thin Shrink Small Outline Package [TSSOP]
4.50
4.40
4.30
PIN 1
1
DB9
0.15
0.00
BSC
0.65
8-Lead Mini Small Outline Package [MSOP]
COPLANARITY
3.00
BSC
PIN 1
16
1
COPLANARITY
0.10
2
DB8
COMPLIANT TO JEDEC STANDARDS MO-187AA
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.38
0.22
8
0.65 BSC
t
5.10
5.00
4.90
13
1
0.10
BSC
3.00
Dimensions shown in millimeters
Dimensions shown in millimeters
3
0.30
0.19
AD7816/AD7817/AD7818
DB7
5
4
SEATING
PLANE
9
8
1.20
MAX
BSC
4.90
SEATING
1.10 MAX
BSC
6.40
PLANE
(RU-16)
(RM-8)
0.20
0.09
0.23
0.08
9
DB1
10
8
0
8
0
DB0
t
14a
0.80
0.60
0.40
0.75
0.60
0.45