MCP98243-BE/MC Microchip Technology, MCP98243-BE/MC Datasheet - Page 45

• Manufacturer Part Number: MCP98243-BE/MC
• Description: IC TEMP SENSOR 3V 2WIRE 8-DFN
• Manufacturer: Microchip Technology

Specifications of MCP98243-BE/MC

• Package / Case: 8-DFN
• Output Type: I²C™/SMBus™
• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Alarm: No
• Output Fan: Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Full Temp Accuracy: +/- 3 C
• Digital Output - Bus Interface: Serial (2-Wire, I2C)
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Ic Output Type: Digital
• Sensing Accuracy Range: ± 0.5°C
• Temperature Sensing Range: -40°C To +125°C
• Supply Current: 200µA
• Supply Voltage Range: 2.7V To 5.5V
• Sensor Case Style: DFN
• No. Of Pins: 8
• Rohs Compliant: Yes
• Resolution (bits): 8bit
• Supply Voltage Min: 3V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

6.0
6.1
The MCP9843/98243 device does not require any
additional components besides the master controller in
order to measure temperature. However, it is recom-
mended that a decoupling capacitor of 0.1 µF to 1 µF
be used between the V
frequency ceramic capacitor is recommended. It is
necessary for the capacitor to be located as close as
possible to the power and ground pins of the device in
order to provide effective noise protection.
In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. For good temperature sensitivity, add a ground
layer under the device pins as shown in
FIGURE 6-1:
© 2009 Microchip Technology Inc.
APPLICATIONS INFORMATION
Layout Considerations
DFN Package Layout.
DD
and GND pins. A high-
GND
Figure
A0
A1
A2
6-1.
EP9
6.2
A potential for self-heating errors can exist if the
MCP9843/98243 SDA, SCLK and Event lines are
heavily loaded with pull-ups (high current). Typically,
the self-heating error is negligible because of the
relatively small current consumption of the MCP9843/
98243. A temperature accuracy error of approximately
0.5°C
communication pins sink/source the maximum current
specified.
For example, if the Event output is loaded to maximum
I
of self-heating.
EQUATION 6-1:
At room temperature (T
I
power dissipation T
and 0.5°C for the TSSOP-8 package.
OL
DD
T
Where:
Δ
V
I
,
OL_Event, SDA
OL_Event, SDA
=
= 500 µA and V
Equation 6-1
θ
JA
(
could
Thermal Considerations
V
DD
MCP9843/98243
θ
V
Event
SCL
SDA
•
T
T
T
JA
I
DD
DD
A
Δ
J
result
+
= T
= Junction Temperature
= Ambient Temperature
= Package Thermal Resistance
= Event and SDA Output V
= Event and SDA Output I
can be used to determine the effect
V
DD
Δ
OL_Event
(0.4 V
(3 mA
J -
is 0.2°C for the DFN-8 package
EFFECT OF SELF-
HEATING
= 3.6V, the self-heating due to
T
from
A
A
max
max
•
= +25°C) with maximum
I
OL_Event
)
)
self-heating
+
DS22153C-page 45
V
OL_SDA
OL
•
OL
I
OL_SDA
if
the
)