MAX6643LBBAEE+ Maxim Integrated Products, MAX6643LBBAEE+ Datasheet - Page 13

• Manufacturer Part Number: MAX6643LBBAEE+
• Description: IC CNTRLR FAN SPEED 16-QSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX6643LBBAEE+

• Function: Fan Control, Temp Monitor
• Topology: ADC, PWM Generator, Tach Counter
• Sensor Type: External & Internal
• Sensing Temperature: -40°C ~ 125°C, External Sensor
• Output Type: PWM
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-QSOP
• Full Temp Accuracy: +/- 3.5 C, +/- 3 C
• Digital Output - Bus Interface: Serial (2-Wire)
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3) Route the DXP and GND traces parallel and close to
4) Route as few vias and crossunders as possible to
5) When introducing a thermocouple, make sure that
each other, away from any high-voltage traces such
as +12VDC. Avoid leakage currents from PCB conta-
mination. A 20M
causes approximately +1°C error.
minimize copper/solder thermocouple effects.
both the DXP and the GND paths have matching
thermocouples. In general, PCB-induced thermocou-
ples are not a serious problem. A copper solder ther-
mocouple
approximately 200µV of voltage error at DXP/GND to
cause a +1°C measurement error, so most parasitic
thermocouple errors are swamped out.
Automatic PWM Fan-Speed Controllers with
exhibits
______________________________________________________________________________________
leakage path from DXP to ground
3µV/°C,
and
it
takes
Overtemperature Output
6) Use wide traces. Narrow traces are more inductive
7) Placing an electrically clean copper ground plane
TRANSISTOR COUNT: 12,518
PROCESS: BiCMOS
and tend to pick up radiated noise. The 10-mil widths
and spacings are recommended, but are not
absolutely necessary (as they offer only a minor
improvement in leakage and noise), but use them
where practical.
between the DXP traces and traces carrying high-
frequency noise signals helps reduce EMI.
Chip Information
13